XENSIV™ Series, Microphones

Results:
6
Manufacturer
Series
S/N Ratio
Current - Supply
Frequency Range
Voltage - Rated
Height (Max)
Ratings
Sensitivity
Output Type
Direction
Voltage Range
Port Location
Shape
Termination
Size / Dimension
Type
Impedance
Results remaining6
Applied Filters:
XENSIV™
Select
ImageProduct DetailPriceAvailabilityECAD ModelShapeOutput TypeTerminationImpedanceRatingsCurrent - SupplySeriesHeight (Max)Size / DimensionTypeDirectionFrequency RangeSensitivityS/N RatioVoltage - RatedVoltage RangePort Location
IM73A135V01XTSA1
MICROPHONES_DIFFERENTIAT PG-LLGA
1+
$2.9662
5+
$2.8014
10+
$2.6366
Quantity
7,826 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Rectangular
Analog
Solder Pads
-
-
170 µA
XENSIV™
0.039" (1.00mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Noise Cancelling
28 Hz ~ 1 kHz
-38dB
73dB
2.75 V
1.52 V ~ 3 V
Top
IM72D128V01XTMA1
1+
$3.0676
5+
$2.8972
10+
$2.7268
Quantity
3,056 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Rectangular
Digital, PDM
Solder Pads
-
IP67 - Dust Tight, Waterproof
1 mA
XENSIV™
0.051" (1.30mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Omnidirectional
20 Hz ~ 19 kHz
-36dB ±1dB @ 94dB SPL
71.5dB
1.8 V
1.62 V ~ 3.6 V
Top
IM72D128V01XTSA1
IP57 DUST AND WATER RESISTANT DI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
Digital, PDM
Solder Pads
-
IP57 - Dust Protected, Waterproof
980 µA
XENSIV™
0.047" (1.20mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Noise Cancelling
-
-36dB ±1dB @ 94dB SPL
72dB
-
1.62 V ~ 3.6 V
Bottom
IM67D120AXTSA1
INTEGRATED PRESSURE SENS PG-LLGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
Digital, PDM
Solder Pads
-
-
1.3 mA
XENSIV™
0.051" (1.30mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Omnidirectional
20 Hz ~ 20 kHz
-26dB ±1dB @ 94dB SPL
67dB
-
1.62 V ~ 3.6 V
Bottom
IM73D122V01XTMA1
MICROPHONES_DIFFERENTIAT PG-LLGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
Digital, PDM
Solder Pads
-
IP57 - Dust Protected, Waterproof
1.12 mA
XENSIV™
0.051" (1.30mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Omnidirectional
20 Hz ~ 19 kHz
-26dB ±1dB @ 94dB SPL
73dB
1.8 V
1.62 V ~ 3.6 V
Top
IM69D130V11XTSA2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
Digital, PDM
Solder Pads
-
-
980 µA
XENSIV™
0.047" (1.20mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Noise Cancelling
-
-36dB ±1dB @ 94dB SPL
69dB
-
1.62 V ~ 3.6 V
Bottom

About  Microphones

Microphones are electronic devices that convert sound waves into electrical signals. This conversion allows for various applications, including storing, transmitting, and rebroadcasting audio. Microphones come in a wide range of designs to suit different needs. There are large boom-style microphones, commonly used in professional recording studios and broadcasting settings, known for their high-quality audio capture. On the other hand, there are smaller and more popular MEMS (MicroElectroMechanical System) microphones, often found in consumer electronics like smartphones and wearable devices due to their compact size and efficiency. These microphones are differentiated by several factors. Impedance refers to the electrical resistance of the microphone's output signal and impacts its compatibility with different audio systems. Voltage rating determines the maximum voltage that can be applied to the microphone without causing damage. Sensitivity refers to the microphone's ability to capture sound accurately and is usually measured in decibels per Pascal (dB/Pa). The frequency range indicates the range of frequencies the microphone can effectively capture, ensuring accurate reproduction of different audio sources. Port location refers to the placement of the microphone's input or output ports, which can affect its suitability for specific applications. Overall size and mounting type play a role in determining the microphone's physical form, making it suitable for different setups and installations. Additionally, microphones offer various output interfaces to connect with audio systems. Analog output interfaces provide a continuous electrical signal that corresponds to the captured sound. I2S (Inter-IC Sound), PDM (Pulse-Density Modulation), and TDM (Time-Division Multiplexing) are digital output interfaces that allow for efficient transmission of audio data between microphones and other devices. By considering these factors, individuals and professionals can choose the right microphone to meet their specific requirements, ensuring optimal sound capture and quality in various applications.