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Zynq® UltraScale+™ Series, Microcontrollers, Microprocessor, FPGA Modules
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Zynq® UltraScale+™
Select | Image | Product Detail | Price | Availability | ECAD Model | Operating Temperature | Series | Speed | Module/Board Type | Core Processor | Co-Processor | Flash Size | RAM Size | Connector Type | Size / Dimension |
|---|
 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 1.3GHz | MPU Core | Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E | ARM® Cortex®-A53 | 512MB | 4GB | Board-to-Board (BTB) Socket | 3.543" L x 2.559" W (90.00mm x 65.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E | - | 256MB | 4GB | Board-to-Board (BTB) Socket | 3.937" L x 2.953" W (100.00mm x 75.00mm) | ||
 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 1.5GHz, 600MHz | MPU, FPGA | ARM® Cortex®-A53(x4), ARM® Cortex™-M7(x1) | ARM® Mali 400 MP2 | 8GB eMMC | 4GB from PS, 4GB from PL | 2 x 240 Pin, 2 x 240 Pin | 4.330" L x 2.950" W (110.00mm x 75.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E | - | 256MB | 4GB | Board-to-Board (BTB) Socket | 3.937" L x 2.953" W (100.00mm x 75.00mm) | ||
 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 1.5GHz, 600MHz | MPU, FPGA | ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1) | ARM® Mali 400 MP2 | 8GB eMMC | 4GB from PS, 4GB from PL | 2 x 240 Pin, 2 x 240 Pin | 4.330" L x 2.950" W (110.00mm x 75.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | ||
 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 1.5GHz, 600MHz | MPU, FPGA | ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | ARM® Mali 400 MP2 | 8GB eMMC | 4GB, 1GB | 2 x 240 Pin | 4.330" L x 2.950" W (110.00mm x 75.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq UltraScale+ ZU11EG-1I | - | 128MB | 16GB | 2 x 400 Pin | 4.724" L x 4.724" W (120.00mm x 120.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq UltraScale+ XCZU4CG-1FBVB900I | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | ||
 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 1.5GHz, 600MHz | MPU, FPG | ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | ARM® Mali 400 MP2 | 8GB eMMC | 4GB, 1GB | 2 x 240 Pin | 4.330" L x 2.950" W (110.00mm x 75.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq™ UltraScale+™ ZU3EG-1I | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.205" L x 1.575" W (56.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq™ UltraScale+™ ZU3EG-1E | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.205" L x 1.575" W (56.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | - | MPU Core | Zynq™ UltraScale+™ ZU2CG | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.205" L x 1.575" W (56.00mm x 40.00mm) |
Microcontrollers, Microprocessor, FPGA Modules
Modular embedded processor family consists of products that combine a microcontroller, microprocessor, digital signal processor, FPGA, or other computational device with support components like memory, power management, and timing. These products are designed to be integrated into end products, providing product developers access to advanced computing and interface capabilities without requiring high-speed hardware design expertise.
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