TE0841 Series, Microcontrollers, Microprocessor, FPGA Modules

Results:
17
Manufacturer
Series
Core Processor
RAM Size
Module/Board Type
Operating Temperature
Flash Size
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Co-Processor
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Results remaining17
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TE0841
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureSeriesSpeedModule/Board TypeCore ProcessorCo-ProcessorFlash SizeRAM SizeConnector TypeSize / Dimension
TE0841-02-040-1I
IC MODULE USCALE 512MB
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
FPGA Core
Kintex UltraScale KU40
-
32MB
512MB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-0401IL
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
MCU, FPGA
Kintex UltraScale KU40
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-41I21-A
MOD SOM USCALE 2GB DDR4
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
MCU, FPGA
Kintex UltraScale KU40
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-32I21-A
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
MCU, FPGA
Kintex UltraScale KU035
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-31C21-A
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
TE0841
-
FPGA Core
Kintex UltraScale KU035
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-41I21-L
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
FPGA Core
Kintex UltraScale KU040
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-31I21-A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
FPGA Core
Kintex UltraScale KU035
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-035-1I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
FPGA Core
Kintex UltraScale KU035
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-035-1C
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
TE0841
-
FPGA Core
Kintex UltraScale KU035
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-41C21-A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
TE0841
-
MCU, FPGA
Kintex UltraScale KU40
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-040-1C
IC MODULE USCALE 2GB 64MB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
TE0841
-
MCU, FPGA
Kintex UltraScale KU40
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-02-035-2I
IC MODULE USCALE 2GB 64MB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
FPGA Core
Kintex UltraScale KU035
-
64MB
2GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-01-040-1I
IC MODULE USCALE 4GB 32MB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
FPGA Core
Kintex UltraScale KU40
-
32MB
4GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-01-040-1C
IC MODULE USCALE 4GB 32MB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
TE0841
-
FPGA Core
Kintex UltraScale KU40
-
32MB
4GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-01-035-2I
IC MODULE USCALE 4GB 32MB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
FPGA Core
Kintex UltraScale KU35
-
32MB
4GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-01-035-1I
IC MODULE USCALE 4GB 32MB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0841
-
FPGA Core
Kintex UltraScale KU35
-
32MB
4GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0841-01-035-1C
IC MODULE USCALE 4GB 32MB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
TE0841
-
FPGA Core
Kintex UltraScale KU35
-
32MB
4GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)

Microcontrollers, Microprocessor, FPGA Modules

Modular embedded processor family consists of products that combine a microcontroller, microprocessor, digital signal processor, FPGA, or other computational device with support components like memory, power management, and timing. These products are designed to be integrated into end products, providing product developers access to advanced computing and interface capabilities without requiring high-speed hardware design expertise.