TE0808 Series, Microcontrollers, Microprocessor, FPGA Modules

Results:
29
Manufacturer
Series
Core Processor
Connector Type
Operating Temperature
RAM Size
Size / Dimension
Module/Board Type
Flash Size
Speed
Co-Processor
Results remaining29
Applied Filters:
TE0808
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureSeriesSpeedModule/Board TypeCore ProcessorCo-ProcessorFlash SizeRAM SizeSize / DimensionConnector Type
TE0808-05-9GI21-AK
ULTRASOM+ MPSOC-MODULE WITH ZYNQ
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0808
-
MPU Core
Zynq UltraScale+ XCZU9EG-2FFVC900I
-
128MB
4GB
2.990" L x 2.050" W (76.00mm x 52.00mm)
4 x 160 Pin
TE0808-05-BBE21-AK
ULTRASOM+ MPSOC MODULE WITH ZYNQ
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
TE0808
-
MPU Core
Zynq UltraScale+ XCZU15EG-1FFVC900E
-
128MB
4GB
2.990" L x 2.050" W (76.00mm x 52.00mm)
Board-to-Board (BTB) Socket - 160
TE0808-04-9GI21-AS
STARTER KIT ZYNQ USCALE+ ZU9 FPG
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0808
-
FPGA Core
Zynq UltraScale+ ZU9
-
128MB
4GB
2.050" L x 2.990" W (52.00mm x 76.00mm)
B2B
TE0808-04-06EG-1EK
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
TE0808
-
MPU Core
Zynq UltraScale+ XCZU6EG-1FFVC900E
-
128MB
4GB
2.050" L x 2.990" W (52.00mm x 76.00mm)
B2B
TE0808-04-15EG-1EK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
TE0808
-
MPU Core
Zynq UltraScale+ XCZU15EG-1FFVC900E
-
128MB
4GB
2.050" L x 2.990" W (52.00mm x 76.00mm)
B2B
TE0808-04-9BE21-AK
IC MOD SOM MPSOC 4GB ZU9EG-E
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
TE0808
-
MPU Core
Zynq UltraScale+ XCZU9EG-1FFVC900E
-
128MB
2GB
2.050" L x 2.990" W (52.00mm x 76.00mm)
B2B
TE0808-05-9GI21-A
USOM+ MPSOC ZYNQ USCALE FPGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
TE0808
-
MPU Core
Zynq UltraScale+ XCZU9EG-2FFVC900I
-
128MB
4GB
2.050" L x 2.990" W (52.00mm x 76.00mm)
B2B
TE0808-04-09EG-1EL
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
TE0808
-
MPU Core
Zynq UltraScale+ XCZU9EG-1FFVC900E
-
128MB
4GB
2.050" L x 2.990" W (52.00mm x 76.00mm)
B2B
TE0808-04-15-1EE-S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
TE0808
-
MPU Core
-
-
-
-
-
-

About  Microcontrollers, Microprocessor, FPGA Modules

Modular embedded processor family consists of products that combine a microcontroller, microprocessor, digital signal processor, FPGA, or other computational device with support components like memory, power management, and timing. These products are designed to be integrated into end products, providing product developers access to advanced computing and interface capabilities without requiring high-speed hardware design expertise.