TE0823 Series, Microcontrollers, Microprocessor, FPGA Modules

Results:
11
Manufacturer
Series
Core Processor
RAM Size
Co-Processor
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Module/Board Type
Operating Temperature
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Results remaining11
Applied Filters:
TE0823
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureSpeedSeriesModule/Board TypeCore ProcessorCo-ProcessorFlash SizeRAM SizeConnector TypeSize / Dimension
TE0823-01-3PIU1MA
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0823
MCU, FPGA
ARM Cortex-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
128MB
1GB
USB
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0823-01-3PIU1ML
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0823
MCU, FPGA
ARM Cortex-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
128MB
1GB
USB
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0823-01-S002
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0823
MCU, FPGA
ARM Cortex-A53, ARM® Cortex®-R5
-
-
-
USB
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0821-01-3BE21ML
MPSOC MODULE WITH XILINX ZYNQ UL
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0823
MPU Core
Zynq UltraScale+ XCZU3EG-1SFVC784E
ARM® Cortex®-A53, ARM® Cortex®-R5
128MB
2GB
2 x 100 Pin
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0821-01-3BE21MA
MPSOC MODULE WITH XILINX ZYNQ UL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0823
MPU Core
Zynq UltraScale+ XCZU3EG-1SFVC784E
ARM® Cortex®-A53, ARM® Cortex®-R5
128MB
2GB
2 x 100 Pin
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0821-01-3AE31PA
MPSOC MODULE WITH XILINX ZYNQ UL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0823
MPU Core
Zynq UltraScale+ XCZU3CG-1SFVC784E
ARM® Cortex®-A53, ARM® Cortex®-R5
128MB
4GB
2 x 100 Pin
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0823-01-3PIU1FA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0823
MCU, FPGA
ARM Cortex-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
128MB
1GB
USB
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0821-01-3BI21MA
MPSOC MODULE WITH XILINX ZYNQ UL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0823
MPU Core
Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
ARM® Cortex®-A53, ARM® Cortex®-R5
128MB
2GB
2 x 160 Pin
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0823-01-S001
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0823
MCU, FPGA
ARM Cortex-A53, ARM® Cortex®-R5
-
-
-
USB
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0821-01-2AE31PA
MPSOC MODULE WITH XILINX ZYNQ UL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0823
MPU Core
Zynq UltraScale+ XCZU2CG-1SFVC784E
ARM® Cortex®-A53, ARM® Cortex®-R5
128MB
4GB
2 x 100 Pin
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0823-01-3PIU1F
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0823
MCU, FPGA
ARM Cortex-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
128MB
1GB
USB
1.970" L x 1.570" W (50.00mm x 40.00mm)

About  Microcontrollers, Microprocessor, FPGA Modules

Modular embedded processor family consists of products that combine a microcontroller, microprocessor, digital signal processor, FPGA, or other computational device with support components like memory, power management, and timing. These products are designed to be integrated into end products, providing product developers access to advanced computing and interface capabilities without requiring high-speed hardware design expertise.