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TE0820 Series, Microcontrollers, Microprocessor, FPGA Modules
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TE0820
Select | Image | Product Detail | Price | Availability | ECAD Model | Operating Temperature | Speed | Series | Module/Board Type | Core Processor | Co-Processor | Flash Size | RAM Size | Connector Type | Size / Dimension |
|---|
 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0820 | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I | 128MB | 2GB | Pin(s) | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU5EV-1SFVC784I | ARM® Cortex®-A53, ARM® Cortex®-R5 | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0820 | MPU Core | Zynq™ UltraScale+™ XCZU4EV-1SFVC784I | ARM® Cortex®-A53, ARM® Cortex®-R5 | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU2CG-1SFVC784I | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | - | - | TE0820 | - | - | - | - | - | - | - | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | - | - | TE0820 | - | - | - | - | - | - | - | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | - | - | TE0820 | - | - | - | - | - | - | - | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU2EG-1SFVC784I | ARM® Cortex®-A53, ARM® Cortex®-R5 | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 128MB | 1GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 128MB | 1GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 128MB | 2GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 80°C | - | TE0820 | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 128MB | 2GB | B2B | 1.570" L x 1.970" W (40.00mm x 50.00mm) |
About Microcontrollers, Microprocessor, FPGA Modules
Modular embedded processor family consists of products that combine a microcontroller, microprocessor, digital signal processor, FPGA, or other computational device with support components like memory, power management, and timing. These products are designed to be integrated into end products, providing product developers access to advanced computing and interface capabilities without requiring high-speed hardware design expertise.
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