TE0820 Series, Microcontrollers, Microprocessor, FPGA Modules

Results:
47
Manufacturer
Series
Core Processor
Co-Processor
Connector Type
Operating Temperature
Flash Size
RAM Size
Size / Dimension
Module/Board Type
Speed
Results remaining47
Applied Filters:
TE0820
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureSpeedSeriesModule/Board TypeCore ProcessorCo-ProcessorFlash SizeRAM SizeConnector TypeSize / Dimension
TE0820-05-2AE21MA
MOD MPSOC ZU2CG-1E 2GB DDR4 IND
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-05-4AI21MI
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
TE0820
MPU Core
-
-
128MB
2GB
-
-
TE0820-05-2BE21ML
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-05-2BE21MAJ
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-05-3BE21ML
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-05-3AE21MA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-05-2BE21MA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-05-4DE21MA
MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-05-3BE21MA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-05-4AE21MA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-02-02CG-1EA
IC MODULE ZYNQ USCALE 1GB 128MB
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
Zynq UltraScale+ XCZU2CG-1SFVC784E
-
128MB
1GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-05-5DR21MA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
TE0820
MPU Core
-
-
128MB
2GB
-
-
TE0820-05-2BI21MA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-04-50121MA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
TE0820
-
-
-
-
-
-
-
TE0820-04-4B121PL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
TE0820
-
-
-
-
-
-
-
TE0820-04-40121MA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
TE0820
-
-
-
-
-
-
-
TE0820-04-2BI21M
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0820
MPU Core
Zynq UltraScale+ XCZU2EG-1SFVC784I
-
128MB
2GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-04-4DE21FA
MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
Zynq UltraScale+ XCZU4EV-1SFVC784E
-
128MB
2GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
TE0820-03-04EV-1EA
IC MODULE ZYNQ USCALE 2GB 128MB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
Zynq UltraScale+ XCZU4EV-1SFVC784E
-
128MB
2GB
B2B
1.570" L x 1.970" W (40.00mm x 50.00mm)
TE0820-02-03CG-1EA
IC MODULE ZYNQ USCALE 1GB 128MB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0820
MPU Core
Zynq UltraScale+ XCZU3CG-1SFVC784E
-
128MB
1GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)

Microcontrollers, Microprocessor, FPGA Modules

Modular embedded processor family consists of products that combine a microcontroller, microprocessor, digital signal processor, FPGA, or other computational device with support components like memory, power management, and timing. These products are designed to be integrated into end products, providing product developers access to advanced computing and interface capabilities without requiring high-speed hardware design expertise.