TE0807 Series, Microcontrollers, Microprocessor, FPGA Modules

Results:
8
Manufacturer
Series
Core Processor
Connector Type
Operating Temperature
Size / Dimension
Module/Board Type
Speed
Co-Processor
Flash Size
RAM Size
Results remaining8
Applied Filters:
TE0807
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureSpeedSeriesModule/Board TypeCore ProcessorCo-ProcessorFlash SizeRAM SizeConnector TypeSize / Dimension
TE0807-03-7AI21-A
MPSOC ZYNQ USCALE 4GB DDR4
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0807
MPU Core
Zynq UltraScale+ XCZU7CG-1FBVB900I
-
128MB
4GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
TE0807-03-7DI21-A
MPSOC ZYNQ USCALE 4GB DDR4
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0807
MPU Core
Zynq UltraScale+ XCZU7EV-1FBVB900I
-
128MB
4GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
TE0807-02-07EV-1E
IC MODULE ZYNQ USCALE 4GB 128MB
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0807
MPU Core
Zynq UltraScale+ XCZU7EV-1FBVB900E
-
128MB
4GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
TE0807-03-4AI21-A
MPSOC ZYNQ USCALE 4GB DDR4
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
-
TE0807
MPU Core
Zynq UltraScale+ XCZU4CG-1FBVB900I
-
128MB
4GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
TE0807-03-7DE21-A
MPSOC MODULE WITH XILINX ZYNQ UL
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0807
MPU Core
Zynq UltraScale+ XCZU7EV-1FBVB900E
-
128MB
4GB
4 x 160 Pin
2.990" L x 2.050" W (76.00mm x 52.00mm)
TE0807-03-4BE21-A
MPSOC MODULE WITH XILINX ZYNQ UL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0807
MPU Core
Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
-
128MB
4GB
Board-to-Board (BTB) Socket - 160
2.990" L x 2.050" W (76.00mm x 52.00mm)
TE0807-03-4BE21-AK
MPSOC MODULE TE0807 WITH ZYNQ UL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0807
MPU Core
Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
-
128MB
4GB
Board-to-Board (BTB) Socket - 160
2.990" L x 2.050" W (76.00mm x 52.00mm)
TE0807-03-7DE21-AK
MPSOC MODULE TE0807 WITH ZYNQ UL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C
-
TE0807
MPU Core
Zynq UltraScale+ XCZU7EV-1FBVB900E
-
128MB
4GB
Board-to-Board (BTB) Socket - 160
2.990" L x 2.050" W (76.00mm x 52.00mm)

About  Microcontrollers, Microprocessor, FPGA Modules

Modular embedded processor family consists of products that combine a microcontroller, microprocessor, digital signal processor, FPGA, or other computational device with support components like memory, power management, and timing. These products are designed to be integrated into end products, providing product developers access to advanced computing and interface capabilities without requiring high-speed hardware design expertise.