Blackfin® Series, Microcontrollers, Microprocessor, FPGA Modules

Results:
8
Manufacturer
Series
Core Processor
Speed
Size / Dimension
RAM Size
Flash Size
Operating Temperature
Connector Type
Module/Board Type
Co-Processor
Results remaining8
Applied Filters:
Blackfin®
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureSeriesModule/Board TypeCore ProcessorCo-ProcessorSpeedFlash SizeRAM SizeConnector TypeSize / Dimension
100-1225-1
IC MOD TCM-BF537 500MHZ 32MB
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Blackfin®
MPU Core
TCM-BF537
-
500MHz
8MB
32MB
Expansion 2 x 60
1.100" L x 1.100" W (28.00mm x 28.00mm)
100-1254-2
IC MOD CM-BF527 600MHZ 64MB
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
Blackfin®
MPU Core
CM-BF527
-
600MHz
8MB
64MB
Expansion 2 x 60
1.220" L x 1.420" W (31.00mm x 36.00mm)
100-1241-1
IC MOD CM-BF548 533MHZ 64MB
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Blackfin®
MPU Core
CM-BF548
-
533MHz
8MB
64MB
Expansion 2 x 100
1.220" L x 1.610" W (31.00mm x 41.00mm)
100-1218-1
IC MOD ADSP-BF609 500MHZ X 2
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Blackfin®
MPU Core
ADSP-BF609 (Dual Core)
-
500MHz x 2
8MB
256KB
Expansion 2 x 100
1.730" L x 1.300" W (44.00mm x 33.00mm)
100-1221-3
IC MOD CM-BF537 600MHZ 32MB
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
Blackfin®
MPU Core
CM-BF537
-
600MHz
4MB
32MB
Expansion 2 x 60
1.440" L x 1.240" W (36.50mm x 31.50mm)
100-1214-1
IC MOD CM-BF561 600MHZ X 2 128KB
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
Blackfin®
MPU Core
CM-BF561 (Dual Core)
-
600MHz x 2
32MB
128KB
Expansion 2 x 100
1.730" L x 1.300" W (44.00mm x 33.00mm)
100-1217-1
IC MOD ADSP-BF609 500MHZ X 2
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 70°C
Blackfin®
MPU Core
ADSP-BF609 (Dual Core)
-
500MHz x 2
8MB
256KB
Expansion 2 x 100
1.730" L x 1.300" W (44.00mm x 33.00mm)
100-1215-1
IC MOD CM-BF561 600MHZ X 2 128KB
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Blackfin®
MPU Core
CM-BF561 (Dual Core)
-
600MHz x 2
32MB
128KB
Expansion 2 x 100
1.730" L x 1.300" W (44.00mm x 33.00mm)

About  Microcontrollers, Microprocessor, FPGA Modules

Modular embedded processor family consists of products that combine a microcontroller, microprocessor, digital signal processor, FPGA, or other computational device with support components like memory, power management, and timing. These products are designed to be integrated into end products, providing product developers access to advanced computing and interface capabilities without requiring high-speed hardware design expertise.