NDS73P Series, Memory

Results:
14
Manufacturer
Series
Operating Temperature
Clock Frequency
Memory Interface
Supplier Device Package
Access Time
Package / Case
Memory Organization
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Memory Type
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Write Cycle Time - Word, Page
Memory Size
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Voltage - Supply
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Results remaining14
Applied Filters:
NDS73P
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeOperating TemperatureVoltage - SupplyPackage / CaseAccess TimeGradeClock FrequencyMemory TypeMemory FormatTechnologyMemory SizeMemory OrganizationMemory InterfaceWrite Cycle Time - Word, PageSupplier Device PackageQualificationSeries
NDS73PBE-20ET TR
SDR 128MB X32 BGA 8X13(X1.2) PC2
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0°C ~ 70°C (TA)
3V ~ 3.6V
90-TFBGA
-
-
200 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P
NDS73PBE-20ET
SDR 128MB X32 BGA 8X13(X1.2) PC2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0°C ~ 70°C (TA)
3V ~ 3.6V
90-TFBGA
-
-
200 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P
NDS73PBE-16ET TR
SDR 128MB X32 BGA 8X13(X1.2) PC1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0°C ~ 70°C (TA)
3V ~ 3.6V
90-TFBGA
-
-
166 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P
NDS73PBE-16ET
SDR 128MB X32 BGA 8X13(X1.2) PC1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0°C ~ 70°C (TA)
3V ~ 3.6V
90-TFBGA
-
-
166 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P
NDS73PBE-20IT TR
SDR 128MB X32 BGA 8X13(X1.2) PC2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 85°C (TA)
3V ~ 3.6V
90-TFBGA
5 ns
-
200 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P
NDS73PBE-20IT
SDR 128MB X32 BGA 8X13(X1.2) PC2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 85°C (TA)
3V ~ 3.6V
90-TFBGA
5 ns
-
200 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P
NDS73PBE-16AT TR
SDR 128MB X32 BGA 8X13(X1.2) PC1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
90-TFBGA
-
-
166 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P
NDS73PBE-16AT
SDR 128MB X32 BGA 8X13(X1.2) PC1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
90-TFBGA
-
-
166 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P
NDS73PT9-20AT TR
SDR 128MB X32 TSOPII 86L 10X22(X
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
86-TFSOP (0.400", 10.16mm Width)
-
-
200 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
86-TSOP II
-
NDS73P
NDS73PT9-16AT
SDR 128MB X32 TSOPII 86L 10X22(X
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
86-TFSOP (0.400", 10.16mm Width)
-
-
166 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
86-TSOP II
-
NDS73P
NDS73PT9-16AT TR
SDR 128MB X32 TSOPII 86L 10X22(X
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
86-TFSOP (0.400", 10.16mm Width)
-
-
166 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
Parallel
-
86-TSOP II
-
NDS73P
NDS73PT9-20AT
SDR 128MB X32 TSOPII 86L 10X22(X
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
86-TFSOP (0.400", 10.16mm Width)
-
-
200 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
86-TSOP II
-
NDS73P
NDS73PBE-20AT TR
SDR 128MB X32 BGA 8X13(X1.2) PC2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
90-TFBGA
-
-
200 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P
NDS73PBE-20AT
SDR 128MB X32 BGA 8X13(X1.2) PC2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
90-TFBGA
-
-
200 MHz
Volatile
DRAM
SDRAM
128Mbit
4M x 32
LVTTL
-
90-FBGA (8x13)
-
NDS73P

Memory

Memory refers to semiconductor devices used for data storage on integrated circuits. Memory devices come in various formats, including CBRAM, DRAM, EEPROM, EERAM, EPROM, Flash, FRAM, NVSRAM, PCM (PRAM), PSRAM, RAM, and SRAM. These formats can be categorized as either non-volatile or volatile memory. Non-volatile memory, such as EEPROM, EERAM, EPROM, Flash, FRAM, and PCM, retains stored data even when power is removed. This makes them suitable for applications where data retention is crucial, such as storing firmware or configuration settings. Volatile memory, including DRAM, PSRAM, RAM, and SRAM, requires power to maintain stored data. While volatile memory loses its content when power is removed, it offers faster read and write speeds, making it ideal for temporary storage and dynamic data processing tasks. Memory sizes vary widely, ranging from small capacity options like 64 b (bits) to large capacity options like 6 Tb (terabits). The interface of memory devices depends on the specific format and can include options such as I2C, MMC, Parallel, eMMC, Serial, Single Wire, SPI, UFS, Xccela Bus, and 1-Wire. These interfaces determine how the memory device communicates with the rest of the system. Integrated Circuits (ICs) - Memory play a critical role in storing and accessing data within digital systems. They provide the necessary storage capacity and performance characteristics required for efficient data management. Whether it's non-volatile memory for long-term storage or volatile memory for temporary data handling, memory ICs enable the functioning of various electronic devices and systems, including computers, smartphones, IoT devices, and more.