NDS36P Series, Memory

Results:
11
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Series
Operating Temperature
Write Cycle Time - Word, Page
Access Time
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Supplier Device Package
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NDS36P
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeOperating TemperatureVoltage - SupplyAccess TimeGradeMemory TypeMemory FormatTechnologyMemory SizeMemory OrganizationMemory InterfaceClock FrequencyWrite Cycle Time - Word, PagePackage / CaseSupplier Device PackageQualificationSeries
NDS36PT5-16ET
SDR 256MB X16 TSOPII 54L 10X22(X
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
0°C ~ 70°C (TA)
3V ~ 3.6V
-
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
166 MHz
-
54-TSOP (0.400", 10.16mm Width)
54-TSOP II
-
NDS36P
NDS36PT5-20ET
SDR 256MB X16 TSOPII 54L 10X22(X
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0°C ~ 70°C (TA)
3V ~ 3.6V
-
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
200 MHz
-
54-TSOP (0.400", 10.16mm Width)
54-TSOP II
-
NDS36P
NDS36PT5-16IT
SDR 256MB X16 TSOPII 54L 10X22(X
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 85°C (TA)
3V ~ 3.6V
5 ns
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
166 MHz
12ns
54-TSOP (0.400", 10.16mm Width)
54-TSOP II
-
NDS36P
NDS36PT5-16AT
SDR 256MB X16 TSOPII 54L 10X22(X
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
5 ns
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
166 MHz
12ns
54-TSOP (0.400", 10.16mm Width)
54-TSOP II
-
NDS36P
NDS36PT5-16AT TR
SDR 256MB X16 TSOPII 54L 10X22(X
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
5 ns
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
166 MHz
12ns
54-TSOP (0.400", 10.16mm Width)
54-TSOP II
-
NDS36P
NDS36PBA-20ET TR
SDR 256MB X16 BGA 8X8(X1.2) PC20
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0°C ~ 70°C (TA)
3V ~ 3.6V
-
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
200 MHz
-
54-TFBGA
54-FBGA (8x8)
-
NDS36P
NDS36PBA-20ET
SDR 256MB X16 BGA 8X8(X1.2) PC20
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0°C ~ 70°C (TA)
3V ~ 3.6V
-
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
200 MHz
-
54-TFBGA
54-FBGA (8x8)
-
NDS36P
NDS36PBA-20IT TR
SDR 256MB X16 BGA 8X8(X1.2) PC20
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 85°C (TA)
3V ~ 3.6V
4.5 ns
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
200 MHz
10ns
54-TFBGA
54-FBGA (8x8)
-
NDS36P
NDS36PBA-20IT
SDR 256MB X16 BGA 8X8(X1.2) PC20
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 85°C (TA)
3V ~ 3.6V
4.5 ns
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
200 MHz
10ns
54-TFBGA
54-FBGA (8x8)
-
NDS36P
NDS36PBA-16AT TR
SDR 256MB X16 BGA 8X8(X1.2) PC16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
5 ns
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
166 MHz
12ns
54-TFBGA
54-FBGA (8x8)
-
NDS36P
NDS36PBA-16AT
SDR 256MB X16 BGA 8X8(X1.2) PC16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
-40°C ~ 105°C (TA)
3V ~ 3.6V
5 ns
-
Volatile
DRAM
SDRAM
256Mbit
16M x 16
LVTTL
166 MHz
12ns
54-TFBGA
54-FBGA (8x8)
-
NDS36P

Memory

Memory refers to semiconductor devices used for data storage on integrated circuits. Memory devices come in various formats, including CBRAM, DRAM, EEPROM, EERAM, EPROM, Flash, FRAM, NVSRAM, PCM (PRAM), PSRAM, RAM, and SRAM. These formats can be categorized as either non-volatile or volatile memory. Non-volatile memory, such as EEPROM, EERAM, EPROM, Flash, FRAM, and PCM, retains stored data even when power is removed. This makes them suitable for applications where data retention is crucial, such as storing firmware or configuration settings. Volatile memory, including DRAM, PSRAM, RAM, and SRAM, requires power to maintain stored data. While volatile memory loses its content when power is removed, it offers faster read and write speeds, making it ideal for temporary storage and dynamic data processing tasks. Memory sizes vary widely, ranging from small capacity options like 64 b (bits) to large capacity options like 6 Tb (terabits). The interface of memory devices depends on the specific format and can include options such as I2C, MMC, Parallel, eMMC, Serial, Single Wire, SPI, UFS, Xccela Bus, and 1-Wire. These interfaces determine how the memory device communicates with the rest of the system. Integrated Circuits (ICs) - Memory play a critical role in storing and accessing data within digital systems. They provide the necessary storage capacity and performance characteristics required for efficient data management. Whether it's non-volatile memory for long-term storage or volatile memory for temporary data handling, memory ICs enable the functioning of various electronic devices and systems, including computers, smartphones, IoT devices, and more.