PRONER Series, Leadframe

Results:
2
Manufacturer
Series
Frame Width
Contact Finish
Clip Type
Termination
Clip Length
Clip Style
Pin Length
Contact Material
Pitch
Frame Thickness
Features
Board Thickness
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PRONER
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ImageProduct DetailPriceAvailabilityECAD ModelFeaturesContact FinishContact MaterialBoard ThicknessPitchClip StyleClip TypeClip LengthPin LengthTerminationFrame ThicknessFrame WidthSeries
1544172-2
DIL CONTACT Y1 THROUGH HOLE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Tin
Phosphor Bronze
-
0.100" (2.54mm)
DIL
Y1
0.055" (1.40mm)
0.358" (9.10mm)
Through Hole
0.010" (0.25mm)
0.713" (18.10mm)
PRONER
1544172-1
DIL CONTACT Y1 THROUGH HOLE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Tin
Phosphor Bronze
-
0.100" (2.54mm)
DIL
Y1
0.055" (1.40mm)
0.358" (9.10mm)
Through Hole
0.010" (0.25mm)
0.713" (18.10mm)
PRONER

Leadframe

Leadframe terminals play a crucial role in connecting the thin metal leadframe wiring of semiconductors to the larger-scale circuitry found on electrical devices and circuit boards. These terminals, along with leadframes themselves, are utilized in nearly all semiconductor packages. When selecting leadframe terminals, various factors come into play. Terminal pitch, which refers to the spacing between terminals, is an important consideration to ensure compatibility with the specific package design. The frame width and thickness of the leadframe terminals also need to be taken into account, as they determine the overall robustness and mechanical stability of the connection. The choice of clip style and type is another significant factor in selecting leadframe terminals. Different clip styles, such as J-leads, gull-wing leads, or flat leads, offer distinct advantages depending on the application requirements. Additionally, the dimensional considerations, including pin length, clip length, and board thickness, must be carefully evaluated to ensure proper fit and reliable electrical connections. Leadframe terminals act as the crucial link between the semiconductor's internal wiring and the external circuitry, enabling the seamless transmission of electrical signals. They provide a standardized and efficient solution for connecting semiconductors to circuit boards and electrical devices, ensuring the optimal performance and functionality of these electronic systems.