Microchip Technology

Microchip Technology

Micron Technology is a global leader in the development and manufacturing of advanced memory and storage solutions. The company's products include DRAM, NAND Flash, and NOR Flash memory, which are used in a wide range of applications, such as smartphones, computers, servers, automotive systems, and IoT devices. Micron's innovative technologies provide high-performance, energy-efficient, and reliable solutions for data-intensive applications. The company's commitment to research and development has led to numerous technological breakthroughs, including the world's first 176-layer 3D NAND Flash memory. Micron is also dedicated to sustainability, implementing eco-friendly practices in its manufacturing processes and promoting responsible sourcing of raw materials. With a focus on quality, innovation, and customer satisfaction, Micron Technology continues to be a trusted partner for businesses seeking cutting-edge memory and storage solutions.

Integrated Circuits (ICs) Kits

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ImageProduct DetailPriceAvailabilityECAD ModelSeriesMounting TypeQuantityKit ContentsKit Type
EPP001
PICMICRO FLASH KIT/LIT & SAMPLE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
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SEEPROM1-KIT
KIT LOW-DENSITY SERIAL EEPROM
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Quantity
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PCB Symbol, Footprint & 3D Model
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Through Hole
9 Pieces (3 Values - 3 Each)
93AA46B, 24AA01, 25AA040
Memory
SEEPROM2-KIT
KIT MID-DENSITY SERIAL EEPROM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Through Hole
9 Pieces (3 Values - 3 Each)
-
Memory
SEEPROM3-KIT
KIT HIGH-DENSITY SERIAL EEPROM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Through Hole
9 Pieces (3 Values - 3 Each)
-
Memory
SEEPROM4-KIT
KIT COMBO-DENSITY SERIAL EEPROM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Through Hole
27 Pieces (9 Values - 3 Each)
-
Memory

Integrated Circuits (ICs) Kits

These pre-packaged sets contain both surface mount and through-hole integrated circuits (ICs) intended for evaluation, demonstration, and experimentation purposes. Packaged in cardboard and plastic kit boxes, they encompass a range of components including digital isolators, high-side drivers, logic chips, memory modules, microcontrollers, RF devices, switches, multiplexers, demultiplexers, transceivers, and translators. These kits are customizable based on the required number of values and the quantity of each value.