IC Sockets

Results:
23,974
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Housing Material
Contact Finish Thickness - Post
Contact Finish Thickness - Mating
Operating Temperature
Features
Pitch - Post
Pitch - Mating
Contact Material - Post
Mounting Type
Contact Finish - Post
Contact Material - Mating
Contact Finish - Mating
Termination
Results remaining23,974
Select
ImageProduct DetailPriceAvailabilityECAD ModelMounting TypePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostOperating TemperatureHousing MaterialTypeNumber of Positions or Pins (Grid)SeriesContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
PLCC-032-T-N-TR
CONN SOCKET PLCC 32POS TIN
1+
$7.6056
5+
$7.1831
10+
$6.7606
Quantity
40 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Liquid Crystal Polymer (LCP)
PLCC
32 (2 x 7, 2 x 9)
PLCC
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
1571541-4
CONN SOCKET PLCC 84POS TIN
1+
$7.6056
5+
$7.1831
10+
$6.7606
Quantity
28 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
-
Polyphenylene Sulfide (PPS)
PLCC
84 (4 x 21)
PCS
180.0µin (4.57µm)
Copper Alloy
Closed Frame
180.0µin (4.57µm)
Copper Alloy
110-87-308-41-001101
CONN IC DIP SOCKET 8POS GOLD
1+
$0.5070
5+
$0.4789
10+
$0.4507
Quantity
27 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
110
Flash
Beryllium Copper
Open Frame
-
Brass
110-87-316-41-001101
CONN IC DIP SOCKET 16POS GOLD
1+
$2.0282
5+
$1.9155
10+
$1.8028
Quantity
25 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
110
Flash
Beryllium Copper
Open Frame
-
Brass
3-1571552-6
824-AG31D-ESL-LF=800 DIP GF/SN
1+
$2.8901
5+
$2.7296
10+
$2.5690
Quantity
10 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
1-2199299-2
28P,DIP SKT,600 CL,LDR,PB FREE
1+
$0.5070
5+
$0.4789
10+
$0.4507
Quantity
10 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
Diplomate DL
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Nickel
XR2A-0811-N
CONN IC DIP SOCKET 8POS GOLD
1+
$1.2676
5+
$1.1972
10+
$1.1268
Quantity
3 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
Polybutylene Terephthalate (PBT), Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
XR2
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Beryllium Copper
264-4493-00-0602J
CONN IC DIP SOCKET ZIF 64POS GLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Connector
0.100" (2.54mm)
Gold
Press-Fit
0.100" (2.54mm)
Gold
-55°C ~ 125°C
Polysulfone (PSU), Glass Filled
DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
64 (2 x 32)
Textool™
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
16-810-90T
CONN IC DIP SOCKET 16POS TIN
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole, Right Angle, Vertical
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
-
Polyamide (PA46), Nylon 4/6
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
Vertisockets™ 800
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
12-810-90C
CONN IC DIP SOCKET 12POS GOLD
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole, Right Angle, Vertical
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-
Polyamide (PA46), Nylon 4/6, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
12 (2 x 6)
Vertisockets™ 800
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
115-87-314-41-003101
CONN IC DIP SOCKET 14POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
115
Flash
Beryllium Copper
Open Frame
-
Brass
110-83-632-41-605101
CONN IC DIP SOCKET 32POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
110
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
4816-3004-CP
CONN IC DIP SOCKET 16POS TIN
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
4800
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
110-87-420-41-001101
CONN IC DIP SOCKET 20POS GOLD
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.4" (10.16mm) Row Spacing
20 (2 x 10)
110
Flash
Beryllium Copper
Open Frame
-
Brass
WMS-080Z
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
WMS
Flash
Beryllium Copper
Open Frame, Wash Away
200.0µin (5.08µm)
Brass
1-1825108-2
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
Thermoplastic, Glass Filled
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
Diplomate DL
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
1-1825093-2
CONN IC DIP SOCKET 8POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
Thermoplastic, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
Diplomate DL
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
514-AG7D
CONN IC DIP SOCKET 14POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole, Right Angle, Horizontal
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin-Lead
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
-
25.0µin (0.63µm)
Beryllium Copper
Closed Frame
25.0µin (0.63µm)
Brass
D0806-42
CONN IC DIP SOCKET 6POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Wire Wrap
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
D0
10.0µin (0.25µm)
Beryllium Copper
Open Frame
196.9µin (5.00µm)
Brass
528-AG10D-ES
CONN IC DIP SOCKET 28POS GOLD
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-
-55°C ~ 125°C
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
500
-
Beryllium Copper
Closed Frame
-
Brass

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.