SIP1x Series, IC Sockets

Results:
90
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Operating Temperature
Contact Material - Post
Housing Material
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Type
Features
Contact Material - Mating
Pitch - Mating
Results remaining90
Applied Filters:
SIP1x
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialSeriesTypeNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
SIP1X27-014B
SIP1X27-014B-SIP SOCKET 27 CTS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
27 (1 x 27)
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X14-041B
SIP1X14-041B-SIP SOCKET 14 CTS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
14 (1 x 14)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X32-014B
SIP1X32-014B-SIP SOCKET 32 CTS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
32 (1 x 32)
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X32-011B
SIP1X32-011B-SIP SOCKET 32 CTS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
32 (1 x 32)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X16-041B
SIP1X16-041B-SIP SOCKET 16 CTS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
16 (1 x 16)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X32-001B
SIP1X32-001B-SIP SOCKET 32 POS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
32 (1 x 32)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X27-001B
SIP1X27-001B-SIP SOCKET 27 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
27 (1 x 27)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X20-041B
SIP1X20-041B-SIP SOCKET 20 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
20 (1 x 20)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X32-041B
SIP1X32-041B-SIP SOCKET 32 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
32 (1 x 32)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X06-011B
SIP1X06-011B-SIP SOCKET 6 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
6 (1 x 6)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X07-014B
SIP1X07-014B-SIP SOCKET 7 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
7 (1 x 7)
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X06-001B
SIP1X06-001B-SIP SOCKET 6 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
6 (1 x 6)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X07-011B
SIP1X07-011B-SIP SOCKET 7 CTS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
7 (1 x 7)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X08-011B
SIP1X08-011B-SIP SOCKET 8 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
8 (1 x 8)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X08-001B
SIP1X08-001B-SIP SOCKET 8 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
8 (1 x 8)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X10-011B
SIP1X10-011B-SIP SOCKET 10 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10 (1 x 10)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X05-041B
SIP1X05-041B-SIP SOCKET 5 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
5 (1 x 5)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X02-041B
SIP1X02-041B-SIP SOCKET 2 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
2 (1 x 2)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X12-014B
SIP1X12-014B-SIP SOCKET 12 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
12 (1 x 12)
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X12-011B
SIP1X12-011B-SIP SOCKET 12 CTS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
12 (1 x 12)
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.