SIP1x Series, IC Sockets

Results:
90
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Operating Temperature
Contact Material - Post
Housing Material
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Type
Features
Contact Material - Mating
Pitch - Mating
Results remaining90
Applied Filters:
SIP1x
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
SIP1X32-014BLF
CONN SOCKET SIP 32POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (1 x 32)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X09-001BLF
CONN SOCKET SIP 9POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
9 (1 x 9)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X27-014BLF
CONN SOCKET SIP 27POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
27 (1 x 27)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X16-014BLF
CONN SOCKET SIP 16POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (1 x 16)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X03-011BLF
CONN SOCKET SIP 3POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
3 (1 x 3)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X14-011BLF
CONN SOCKET SIP 14POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (1 x 14)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X32-011BLF
CONN SOCKET SIP 32POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (1 x 32)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X15-014BLF
CONN SOCKET SIP 15POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
15 (1 x 15)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X10-011BLF
CONN SOCKET SIP 10POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
10 (1 x 10)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X15-011BLF
CONN SOCKET SIP 15POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
15 (1 x 15)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X20-011BLF
CONN SOCKET SIP 20POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X16-011BLF
CONN SOCKET SIP 16POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (1 x 16)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X02-001BLF
CONN SOCKET SIP 2POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
2 (1 x 2)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X10-001BLF
CONN SOCKET SIP 10POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
10 (1 x 10)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X17-001BLF
CONN SOCKET SIP 17POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
17 (1 x 17)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X20-001BLF
CONN SOCKET SIP 20POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X20-041BLF
CONN SOCKET SIP 20POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X16-041BLF
CONN SOCKET SIP 16POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (1 x 16)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X02-041BLF
CONN SOCKET SIP 2POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
2 (1 x 2)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X05-041BLF
CONN SOCKET SIP 5POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
5 (1 x 5)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.