0503 Series, IC Sockets

Results:
100
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Pitch - Mating
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Contact Finish Thickness - Mating
Termination
Mounting Type
Type
Contact Material - Mating
Features
Results remaining100
Applied Filters:
0503
Select
ImageProduct DetailPriceAvailabilityECAD ModelFeaturesOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialSeriesTypeNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingContact Finish Thickness - PostContact Material - Post
13-0503-31
CONN SOCKET SIP 13POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA), Nylon, Glass Filled
0503
SIP
13 (1 x 13)
30.0µin (0.76µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
20-0503-30
CONN SOCKET SIP 20POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
20 (1 x 20)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
19-0503-20
CONN SOCKET SIP 19POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
19 (1 x 19)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
19-0503-30
CONN SOCKET SIP 19POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
19 (1 x 19)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
22-0503-20
CONN SOCKET SIP 22POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
22 (1 x 22)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
22-0503-30
CONN SOCKET SIP 22POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
22 (1 x 22)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
21-0503-30
CONN SOCKET SIP 21POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
21 (1 x 21)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
21-0503-20
CONN SOCKET SIP 21POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
21 (1 x 21)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
14-0503-21
CONN SOCKET SIP 14POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA), Nylon, Glass Filled
0503
SIP
14 (1 x 14)
30.0µin (0.76µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
14-0503-31
CONN SOCKET SIP 14POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA), Nylon, Glass Filled
0503
SIP
14 (1 x 14)
30.0µin (0.76µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
02-0503-31
CONN SOCKET SIP 2POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA), Nylon, Glass Filled
0503
SIP
2 (1 x 2)
30.0µin (0.76µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
02-0503-21
CONN SOCKET SIP 2POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polyamide (PA), Nylon, Glass Filled
0503
SIP
2 (1 x 2)
30.0µin (0.76µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
01-0503-31
CONN SOCKET SIP 1POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Through Hole
Wire Wrap
-
Gold
Polyamide (PA), Nylon, Glass Filled
0503
SIP
1 (1 x 1)
30.0µin (0.76µm)
Beryllium Copper
30.0µin (0.76µm)
Brass
01-0503-21
CONN SOCKET SIP 1POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
Gold
Through Hole
Wire Wrap
-
Gold
Polyamide (PA), Nylon, Glass Filled
0503
SIP
1 (1 x 1)
30.0µin (0.76µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
02-0503-20
CONN SOCKET SIP 2POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
2 (1 x 2)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
02-0503-30
CONN SOCKET SIP 2POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
2 (1 x 2)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
08-0503-30
CONN SOCKET SIP 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
8 (1 x 8)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
08-0503-20
CONN SOCKET SIP 8POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
8 (1 x 8)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
24-0503-20
CONN SOCKET SIP 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
24 (1 x 24)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass
24-0503-30
CONN SOCKET SIP 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Tin
Polyamide (PA), Nylon, Glass Filled
0503
SIP
24 (1 x 24)
30.0µin (0.76µm)
Beryllium Copper
200.0µin (5.08µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.