514 Series, IC Sockets

Results:
78
Manufacturer
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Type
Features
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Housing Material
Termination
Mounting Type
Pitch - Post
Contact Finish Thickness - Post
Contact Finish - Post
Contact Material - Mating
Pitch - Mating
Results remaining78
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514
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostOperating TemperatureSeriesTypeNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
514-87-281-19-081117
CONN SOCKET PGA 281POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
PGA
281 (19 x 19)
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-321-19-121154
CONN SOCKET PGA 321POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
PGA
321 (19 x 19)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-192M16-001148
CONN SOCKET BGA 192POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
192 (16 x 16)
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-279-19-081117
CONN SOCKET PGA 279POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
PGA
279 (19 x 19)
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-388M26-001148
CONN SOCKET BGA 388POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
388 (26 x 26)
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-400M20-000148
CONN SOCKET BGA 400POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
400 (20 x 20)
Flash
Beryllium Copper
Closed Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-420M26-001148
CONN SOCKET BGA 420POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
420 (26 x 26)
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-432M31-001148
CONN SOCKET BGA 432POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
432 (31 x 31)
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-357M19-001148
CONN SOCKET BGA 357POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
357 (19 x 19)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-321-19-121154
CONN SOCKET PGA 321POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
PGA
321 (19 x 19)
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-223-18-091117
CONN SOCKET PGA 223POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
PGA
223 (18 x 18)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-419-19-001154
CONN SOCKET PGA 419POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
PGA
419 (19 x 19)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-652M35-001148
CONN SOCKET BGA 652POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
652 (35 x 35)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-419-19-001154
CONN SOCKET PGA 419POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
PGA
419 (19 x 19)
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-576M30-001148
CONN SOCKET BGA 576POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
576 (30 x 30)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-600M35-001148
CONN SOCKET BGA 600POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
600 (35 x 35)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-292M20-001148
CONN SOCKET BGA 292POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
292 (20 x 20)
Flash
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-255M16-001148
CONN SOCKET BGA 255POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
255 (16 x 16)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-256M20-001148
CONN SOCKET BGA 256POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
256 (20 x 20)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-256M16-000148
CONN SOCKET BGA 256POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Surface Mount
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
514
BGA
256 (16 x 16)
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.