YTE Series, Headers, Receptacles, Female Sockets

Results:
342
Manufacturer
Series
Insulation Height
Number of Positions
Number of Positions Loaded
Contact Finish Thickness - Mating
Number of Rows
Row Spacing - Mating
Contact Finish - Post
Contact Length - Post
Ingress Protection
Voltage Rating
Current Rating (Amps)
Contact Type
Material Flammability Rating
Connector Type
Style
Pitch - Mating
Features
Contact Finish - Mating
Operating Temperature
Termination
Mounting Type
Fastening Type
Insulation Color
Mated Stacking Heights
Results remaining342
Applied Filters:
YTE
Select
ImageProduct DetailPriceAvailabilityECAD ModelFeaturesIngress ProtectionContact Finish - MatingMounting TypeTerminationContact Finish - PostMaterial Flammability RatingNumber of PositionsOperating TemperatureInsulation ColorNumber of RowsFastening TypeStyleNumber of Positions LoadedContact TypeMated Stacking HeightsContact Finish Thickness - MatingPitch - MatingRow Spacing - MatingContact Length - PostInsulation HeightSeriesConnector TypeCurrent Rating (Amps)Voltage Rating
YTE-104-03-M-5-375
2.00 MM FLEXYZ HIGH-DENSITY ELEV
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
20
-55°C ~ 105°C
Black
5
Push-Pull
Board to Board
All
Forked
-
20.0µin (0.51µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.375" (9.53mm)
YTE
Elevated Socket
-
-
YTE-115-02-F-Q-675
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
60
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
3.00µin (0.076µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.675" (17.14mm)
YTE
Elevated Socket
-
-
YTE-117-02-F-Q-515
2.00 MM FLEXYZ HIGH-DENSITY ELEV
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
68
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
3.00µin (0.076µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.515" (13.08mm)
YTE
Elevated Socket
-
-
YTE-111-03-L-Q-340
2.00 MM FLEXYZ HIGH-DENSITY ELEV
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
44
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
10.0µin (0.25µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.340" (8.64mm)
YTE
Elevated Socket
-
-
YTE-104-02-M-6-670
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
24
-55°C ~ 105°C
Black
6
Push-Pull
Board to Board
All
Forked
-
20.0µin (0.51µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.670" (17.02mm)
YTE
Elevated Socket
-
-
YTE-110-02-L-Q-730
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
40
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
10.0µin (0.25µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.730" (18.54mm)
YTE
Elevated Socket
-
-
YTE-104-03-G-Q-360
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
16
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
20.0µin (0.51µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.360" (9.14mm)
YTE
Elevated Socket
-
-
YTE-106-02-M-Q-655
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
24
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
20.0µin (0.51µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.655" (16.63mm)
YTE
Elevated Socket
-
-
YTE-103-02-G-Q-470
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
12
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
20.0µin (0.51µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.470" (11.94mm)
YTE
Elevated Socket
-
-
YTE-106-02-L-5-375
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
30
-55°C ~ 105°C
Black
5
Push-Pull
Board to Board
All
Forked
-
10.0µin (0.25µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.375" (9.53mm)
YTE
Elevated Socket
-
-
YTE-102-03-F-5-375
2.00 MM FLEXYZ HIGH-DENSITY ELE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
10
-55°C ~ 105°C
Black
5
Push-Pull
Board to Board
All
Forked
-
3.00µin (0.076µm)
0.079" (2.00mm)
0.079" (2.00mm)
0.050" (1.27mm)
0.375" (9.53mm)
YTE
Elevated Socket
-
-
YTE-104-02-M-5-728
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
20
-55°C ~ 105°C
Black
5
Push-Pull
Board to Board
All
Forked
-
20.0µin (0.51µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.728" (18.50mm)
YTE
Elevated Socket
-
-
YTE-106-03-M-Q-408
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
24
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
20.0µin (0.51µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.408" (10.36mm)
YTE
Elevated Socket
-
-
YTE-103-03-G-Q-408
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
12
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
20.0µin (0.51µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.408" (10.36mm)
YTE
Elevated Socket
-
-
YTE-110-02-F-Q-600
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
40
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
3.00µin (0.076µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.600" (15.24mm)
YTE
Elevated Socket
-
-
YTE-110-02-F-Q-750
2.00 MM FLEXYZ HIGH-DENSITY ELEV
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
40
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
3.00µin (0.076µm)
0.079" (2.00mm)
0.079" (2.00mm)
-
0.750" (19.05mm)
YTE
Elevated Socket
-
-
YTE-119-02-G-5-375
CONN HD ARRAY RCPT 95P VERT GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
95
-55°C ~ 105°C
Black
5
Push-Pull
Board to Board
All
Forked
-
20.0µin (0.51µm)
0.079" (2.00mm)
0.079" (2.00mm)
0.050" (1.27mm)
0.375" (9.53mm)
YTE
Elevated Socket
-
-
YTE-130-02-L-5-655
CONN HD ARRAY RCP 150P VERT GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
150
-55°C ~ 105°C
Black
5
Push-Pull
Board to Board
All
Forked
-
10.0µin (0.25µm)
0.079" (2.00mm)
0.079" (2.00mm)
0.050" (1.27mm)
0.655" (16.63mm)
YTE
Elevated Socket
-
-
YTE-150-02-L-5-645
CONN HD ARRAY RCP 250P VERT GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
250
-55°C ~ 105°C
Black
5
Push-Pull
Board to Board
All
Forked
-
10.0µin (0.25µm)
0.079" (2.00mm)
0.079" (2.00mm)
0.050" (1.27mm)
0.645" (16.38mm)
YTE
Elevated Socket
-
-
YTE-140-03-L-Q-360
CONN HD ARRAY RCP 160P VERT GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Gold
Through Hole
Solder
Tin
-
160
-55°C ~ 105°C
Black
4
Push-Pull
Board to Board
All
Forked
-
10.0µin (0.25µm)
0.079" (2.00mm)
0.079" (2.00mm)
0.050" (1.27mm)
0.360" (9.14mm)
YTE
Elevated Socket
-
-

Headers, Receptacles, Female Sockets

This type of header (receptacle) contains female sockets within a plastic housing and is meant to be mated with a rectangular cable connector or a male pin header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole. 2023/11/28 16:50:32 Female socket headers, also known as receptacle connectors, are designed with female sockets housed within a plastic housing. They are intended to be mated with rectangular cable connectors or male pin headers to facilitate board-to-board connections. These connectors are available in a variety of position and pitch options, with some featuring a breakaway design that allows for easy manual adjustment of the position count. Mounting options for female socket headers include panel mount, board edge, stacking, surface mount, and through-hole. Panel mount connectors are suitable for installation on a flat surface, while board edge connectors are specifically designed to be inserted into the edge of a PCB. Stacking connectors are used to vertically stack multiple PCBs, providing a compact and space-saving solution. Surface mount connectors are directly mounted onto the surface of the PCB using soldering techniques, and through-hole connectors require the PCB to have pre-drilled holes for insertion. In summary, female socket headers offer a versatile and reliable solution for establishing board-to-board connections. With various position and pitch options, including breakaway designs for customization, these connectors cater to diverse application requirements. The availability of different mounting types further enhances their adaptability to specific design needs, ensuring efficient and secure connections within electronic systems and devices.