FF02S Series, FFC, FPC (Flat Flexible) Connector Assemblies

Results:
25
Manufacturer
Series
Number of Positions
Cable End Type
Operating Temperature
Housing Material
Voltage Rating
Contact Finish
Termination
Height Above Board
Material Flammability Rating
Mounting Type
FFC, FCB Thickness
Locking Feature
Connector/Contact Type
Contact Material
Pitch
Features
Actuator Material
Flat Flex Type
Results remaining25
Applied Filters:
FF02S
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureTerminationContact FinishMaterial Flammability RatingContact MaterialNumber of PositionsMounting TypeHousing MaterialFlat Flex TypePitchVoltage RatingSeriesConnector/Contact TypeFFC, FCB ThicknessHeight Above BoardLocking FeatureCable End TypeActuator MaterialFeatures
FF02S40SV1-R3000
CONN FPC BOTTOM 40POS 0.30MM R/A
1+
$1.0141
5+
$0.9577
10+
$0.9014
Quantity
6,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
40
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S25SV1
CONN FPC BOTTOM 25POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
25
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S50SV1
CONN FPC BOTTOM 50POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
50
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S45SV1
CONN FPC BOTTOM 45POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
45
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S40SV1
CONN FPC BOTTOM 40POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
40
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S35SV1-R3000
CONN FPC BOTTOM 35POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
35
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S33SV1
CONN FPC BOTTOM 33POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
33
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S31SV1
CONN FPC BOTTOM 31POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
31
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S29SV1
CONN FPC BOTTOM 29POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
29
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S27SV1
CONN FPC BOTTOM 27POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
27
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S15SV1-R3000
CONN FPC BOTTOM 15POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
15
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S17SV1
CONN FPC BOTTOM 17POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
17
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S15SV1
CONN FPC BOTTOM 15POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
15
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S55SV1
CONN FPC BOTTOM 55POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
55
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S65SV1
CONN FPC BOTTOM 65POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
65
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S65SV1-R3000
CONN FPC BOTTOM 65POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
65
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S33SV1-R3000
CONN FPC BOTTOM 33POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
33
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S31SV1-R3000
CONN FPC BOTTOM 31POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
31
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S29SV1-R3000
CONN FPC BOTTOM 29POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
29
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)
FF02S25SV1-R3000
CONN FPC BOTTOM 25POS 0.30MM R/A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C
Solder
Gold
UL94 V-0
Copper Alloy
25
Surface Mount, Right Angle
Liquid Crystal Polymer (LCP)
FPC
0.012" (0.30mm)
50V
FF02S
Contacts, Bottom
0.12mm
0.035" (0.88mm)
Flip Lock
Straight
Polyphenylene Sulfide (PPS)
Zero Insertion Force (ZIF)

About  FFC, FPC (Flat Flexible) Connector Assemblies

Products in this family are interconnect components specifically designed to be used with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials. These components serve the purpose of establishing a cable-to-board interconnect function by being mounted onto a printed circuit board. They provide both electrical connection and mechanical retention for an inserted FFC or FPC cable. These interconnect products are specifically engineered to accommodate the unique characteristics of FFC and FPC materials. FFC is a type of ribbon-like cable that consists of multiple flat conductors sandwiched between layers of insulation. FPC, on the other hand, refers to a flexible circuit made of a thin film of conductive material deposited onto a flexible substrate. The interconnect components in this family are designed to securely hold and establish electrical connections with FFC or FPC cables. They typically feature a connector housing with contacts that align with the conductive traces on the cable. The FFC or FPC cable is inserted into the connector, and the contacts make contact with the conductive traces, enabling the transfer of electrical signals. In addition to electrical connection, these interconnect products also provide mechanical retention for the inserted cable. This ensures that the cable remains securely attached to the printed circuit board, even in applications where vibrations, movements, or other external forces may be present. The design and configuration of these interconnect components may vary depending on the specific application requirements. Different sizes, pin configurations, and mounting options may be available to suit various FFC and FPC cable types and board layouts. In summary, the products in this family are interconnect components specifically designed for FFC and FPC materials. They serve the purpose of establishing a cable-to-board interconnect function, providing both electrical connection and mechanical retention for the inserted cable. These components are tailored to accommodate the unique characteristics of FFC and FPC materials and may offer various design options to suit different application requirements.