P Series, Ferrite Cores

Results:
21
Manufacturer
Series
Effective Permeability (µe)
Inductance Factor (Al)
Height
Diameter
Effective Area (Ae) mm²
Supplier Device Package
Effective Length (le) mm
Effective Magnetic Volume (Ve) mm³
Minimum Core Cross Section (Amin) mm²
Core Factor (ΣI/A) mm⁻¹
Tolerance
Material
Initial Permeability (µi)
Core Type
Gap
Finish
Length
Initial Permeability (µi)
Width
Results remaining21
Applied Filters:
P
Select
ImageProduct DetailPriceAvailabilityECAD ModelLengthToleranceSeriesWidthSupplier Device PackageCore TypeMaterialDiameterInductance Factor (Al)GapEffective Permeability (µe)Core Factor (ΣI/A) mm⁻¹Effective Length (le) mmEffective Area (Ae) mm²Minimum Core Cross Section (Amin) mm²Effective Magnetic Volume (Ve) mm³FinishHeightInitial Permeability (µi)
PC40P26/16Z-52H
1+
$6.3380
5+
$5.9859
10+
$5.6338
Quantity
1,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
-
P
-
P 26 x 16
P
PC40
1.004" (25.50mm)
3.81 µH
Ungapped
1213
0.4
37.6
94
71.3
3534
Uncoated
0.321" (8.15mm)
2300
H5AP18/11Z-52B-NN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±25%
P
-
P 18 x 11
P
-
0.717" (18.20mm)
4.5 µH
Ungapped
2138
0.596
25.8
43.3
34.4
1117
Uncoated
0.209" (5.30mm)
-
H5AP30/19Z-52H
2PCS POT CORE FOR SIGNAL TRANSFO
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±25%
P
-
P 30 x 19
P (Pot Core)
H5A
1.181" (30.00mm)
9.8 µH
Ungapped
2573
0.33
45.2
137
109
6192
Uncoated
0.748" (19.00mm)
3300
H5AP18/11Z-52B
2PCS POT CORE FOR SIGNAL TRANSFO
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±25%
P
-
P 18 x 11
P (Pot Core)
H5A
-
4.5 µH
Ungapped
2138
0.596
25.8
43.3
34.4
1117
Uncoated
0.417" (10.60mm)
3300
H5AP11/7Z-52H
2PCS POT CORE FOR SIGNAL TRANSFO
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±25%
P
-
P 11 x 7
P (Pot Core)
H5A
-
2.32 µH
Ungapped
1765
0.969
15.5
16
12.4
248
Uncoated
0.130" (3.30mm)
3300
PC40P22/13Z-52H-NN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
P
-
P 22 x 13
P
PC40
0.850" (21.60mm)
2.99 µH
Ungapped
1182
0.497
31.5
63.4
47.7
1997
Uncoated
0.268" (6.80mm)
2300
H5C2P18/11Z-52B-NN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±25%
P
-
P 18 x 11
P
H5C2
0.717" (18.20mm)
4.5 µH
Ungapped
2138
0.596
25.8
43.3
34.4
1117
Uncoated
0.209" (5.30mm)
10000
H5C2P14/8Z-52B
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±30%
P
-
P 14 x 8
P
H5C2
0.559" (14.20mm)
11.5 µH
Ungapped
7221
0.789
19.8
25.1
18.4
497
Uncoated
0.167" (4.25mm)
10000
H5AP5.8/3.3Z-52S-NN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±25%
P
-
P 5.8 x 3.3
P
H5A
0.228" (5.80mm)
870 nH
Ungapped
1163
1.68
7.9
4.7
3.66
37
Uncoated
0.065" (1.65mm)
3300
PC40P11/7Z-52H
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
P
-
P 11 x 7
P
PC40
0.445" (11.30mm)
1.25 µH
Ungapped
951
0.969
15.5
16
12.4
248
Uncoated
0.130" (3.30mm)
2300
H5AP7/4Z-52S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±25%
P
-
P 7 x 4
P
H5A
0.289" (7.35mm)
1.2 µH
Ungapped
1366
1.43
10
7
5.57
70
Uncoated
0.083" (2.10mm)
3300
H5C2P9/5Z-52H
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±30%
P
-
P 9 x 5
P
H5C2
0.366" (9.30mm)
6.03 µH
Ungapped
5998
1.24
12.4
10
7.29
124
Uncoated
0.106" (2.70mm)
10000
PC40P9/5Z-52H-NN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
P
-
P 9 x 5
P
PC40
0.289" (7.35mm)
825 nH
Ungapped
821
1.24
12.4
10
7.29
124
Uncoated
0.136" (3.45mm)
PC40P30/19Z-52H-NN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±25%
P
-
P 30 x 19
P
PC40
1.181" (30.00mm)
7.3 µH
Ungapped
1917
0.33
45.2
137
109
6192
Uncoated
0.315" (8.00mm)
2300
PC40P18/11Z-52B
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
P
-
P 18 x 11
P
PC40
0.717" (18.20mm)
2.4 µH
Ungapped
1140
0.596
25.8
43.3
34.4
1117
Uncoated
0.209" (5.30mm)
2300
PC40P11/7A100-52H-NN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±3%
P
-
P 11 x 7
P
PC40
0.445" (11.30mm)
100 nH
Gapped
75
0.969
15.5
16
12.4
248
-
0.130" (3.30mm)
2300
PC40P9/5A100-52H
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±3%
P
-
P 9 x 5
P
PC40
0.366" (9.30mm)
100 nH
Gapped
100
1.24
12.4
10
7.29
124
Uncoated
0.106" (2.70mm)
H5C2P26/16Z-52H
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±30%
P
-
P 26 x 16
P
H5C2
1.004" (25.50mm)
24.5 µH
Ungapped
7800
0.4
37.6
94
71.3
3534
Uncoated
0.321" (8.15mm)
10000
H5C2P22/13Z-52H
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±30%
P
-
P 22 x 13
P
H5C2
0.850" (21.60mm)
19.5 µH
Ungapped
7700
0.497
31.5
63.4
47.7
1997
Uncoated
0.268" (6.80mm)
10000
PC40P9/5A160-52H
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±5%
P
-
P 9 x 5
P
PC40
0.366" (9.30mm)
160 nH
Gapped
160
1.24
12.4
10
7.29
124
Uncoated
0.106" (2.70mm)
2300

About  Ferrite Cores

Ferrite cores are an essential component used in the winding of transformers and other wound components. These cores are designed with a specific chemical composition that helps to minimize the occurrence of eddy currents, which can negatively impact the performance of magnetic devices. Ferrite cores are available in various form factors to accommodate different application requirements. Some common form factors include E-shaped cores, toroidal cores, ER cores, multi-hole cores, and more. Each form factor has its own unique characteristics and benefits, making them suitable for specific applications. Furthermore, ferrite cores come in a wide range of sizes to cater to different design needs. The size of the core is an important parameter to consider as it directly affects the overall dimensions and performance of the magnetic device. When selecting a ferrite core, key parameters to consider are the size, form factor or core type, and inductance factor. The size of the core should be chosen based on the space constraints and power handling requirements of the application. The form factor or core type should align with the design goals and electrical specifications of the device. Lastly, the inductance factor, which is determined by the core material and geometry, plays a crucial role in achieving the desired electrical characteristics of the magnetic component. By carefully considering these parameters and selecting the appropriate ferrite core, engineers can optimize the performance, efficiency, and reliability of their magnetic devices. Ferrite cores play a vital role in the construction of transformers and other wound components, enabling efficient power transfer and electromagnetic compatibility in a wide range of electronic and electrical applications.