Heat Pipes, Vapor Chambers

Results:
1,343
Manufacturer
Series
Power - Cooling
Width
Length
Height
Thermal Resistance
Diameter
Operating Temperature
Shape
Platform
Attachment Method
Wick Type
Material
Type
Features
Results remaining1,343
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesTypeFeaturesOperating TemperatureLengthShapeHeightMaterialWidthDiameterPlatformAttachment MethodThermal ResistanceWick TypePower - Cooling
126291
FLATTENED, COPPER HEATPIPE, SINT
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PCB Symbol, Footprint & 3D Model
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126389
FLATTENED, COPPER HEATPIPE, SINT
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PCB Symbol, Footprint & 3D Model
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126557
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126625
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126473
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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124663
ROUND HEATPIPE 10X350MM 60W
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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13.780" (350.00mm)
Round
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Copper
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0.394" (10.00mm) OD
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Epoxy or Solder
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Sintered
60.0W @ 350mm
126591
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126088
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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15.748" (400.00mm)
Flat
0.118" (3.00mm)
Copper
0.427" (10.85mm)
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Epoxy or Solder
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Sintered
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126243
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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15.748" (400.00mm)
Flat
0.157" (4.00mm)
Copper
0.405" (10.29mm)
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Epoxy or Solder
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Sintered
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126029
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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15.748" (400.00mm)
Flat
0.098" (2.50mm)
Copper
0.439" (11.14mm)
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Epoxy or Solder
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Sintered
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126059
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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15.748" (400.00mm)
Flat
0.106" (2.70mm)
Copper
0.434" (11.03mm)
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Epoxy or Solder
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Sintered
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126141
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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15.748" (400.00mm)
Flat
0.126" (3.20mm)
Copper
0.423" (10.74mm)
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Epoxy or Solder
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Sintered
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126558
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126626
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126660
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126341
FLATTENED, COPPER HEATPIPE, SINT
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PCB Symbol, Footprint & 3D Model
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126390
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126432
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126292
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126516
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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About  Heat Pipes, Vapor Chambers

Thermal heat pipes and vapor chambers are essential devices used for transferring heat between two interfaces. They work by heating a liquid until it becomes a vapor on the hot interface, after which the vapor travels to the cold interface and condenses back into a liquid. This process allows for efficient thermal transfer across a wide range of temperatures and applications. These heat transfer devices come in various shapes such as flat, rectangular, round, and square, with each shape being suitable for different types of systems and spaces. The choice of shape depends on factors such as available space, power requirements, and desired cooling performance. Moreover, thermal heat pipes and vapor chambers are identified by their unique properties such as power cooling, thermal resistance, and wick type. These characteristics determine the efficiency and effectiveness of the device in transferring heat in different environments and applications. Power cooling refers to the rate at which the device can dissipate heat, while thermal resistance measures the ability of the device to resist heat flow. Wick type, on the other hand, refers to the material used to line the interior of the device, which affects the rate and efficiency of heat transfer. In summary, thermal heat pipes and vapor chambers are crucial devices used in various industries for efficient thermal management. Their ability to transfer heat between two interfaces with high efficiency and reliability makes them essential for achieving optimal performance and longevity of electronic devices, power systems, and other applications that require efficient heat dissipation. The choice of device depends on factors such as available space, power requirements, and desired cooling performance, with their unique properties determining their efficiency and effectiveness in different applications.