Adhesives, Epoxies, Greases, Pastes

Results:
676
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining676
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ImageProduct DetailPriceAvailabilityECAD ModelColorFeaturesShelf LifeStorage/Refrigeration TemperatureTypeSize / DimensionUsable Temperature RangeThermal ConductivitySeries
BT-302-50M
FAST CURING ALUMINUM FILLED BOND
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
12 Months
-
Epoxy, 2 Part
50 ml Cartridges
-
-
BondaTherm™
8329HTC-400ML
SUPER THERMALLY CONDUCTIVE EPOXY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
12 Months
-
Epoxy, 2 Part
400 ml Cartridge
-
-
8329HTC
PRT-09599
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
-
-
Silicone Compound
5 gram Syringe
-22°F ~ 482°F (-30°C ~ 250°C)
1.17W/m-K
-
1401008
2151 THERMALLY CONDUCTIVE ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
Blue
-
-
80.6°F (27°C)
Epoxy, 2 Part
3 gram Container
-94°F ~ 239°F (-70°C ~ 115°C)
0.95W/m-K
TRA-BOND
9460TC-10ML
Wire & Wire Management
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
-
86°F (30°C) or Below
Epoxy Adhesive
10 ml Syringe
-85°F ~ 302°F (-65°C ~ 150°C)
0.80W/m-K
9460TC
B-4-NC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
36 Months
-
Hardener Epoxy
-
302°F (150°C)
-
-
230178
7387 THERMAL ADHESIVE ACTIVATOR
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Quantity
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PCB Symbol, Footprint & 3D Model
Yellow
-
-
46.4°F ~ 69.8°F (8°C ~ 21°C)
Activator
13 ml Bottle
-
-
LOCTITE® 7387™
BT-402-H
THERMALLY CONDUCTIVE EPOXY POTTI
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
12 Months
-
Potting Compound, 2 Part
100 gram Hinge Pack
-
-
BondaTherm™
1188044
CATALYST 24LV CLR 8OZ INDIVIDUAL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
12 Months
-
-
-
-
-
LOCTITE® 2850
122-10CC
SILICONE GREASE 10CC SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
60 Months
-
Silicone Compound
10cc Syringe
-40°F ~ 401°F (-40°C ~ 205°C)
2.50W/m-K
122
1188045
CATALYST 24LV CLR 1LB INDIVIDUAL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
LOCTITE® 2850
122-2
SILICONE GREASE 2OZ JAR
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
60 Months
-
Silicone Compound
2 oz Jar
-40°F ~ 401°F (-40°C ~ 205°C)
2.50W/m-K
122
1188035
CATALYST 23LV CLR 1LB 0.454KG
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
-
12 Months
77°F (25°C)
Epoxy, 2 Part (Order Catalyst Separately)
1 lb Container
-85°F ~ 221°F (-65°C ~ 105°C)
1.22W/m-K
LOCTITE® Ablestik 285
1695226
TCP 4000 55CC EFD EN/CH
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
6 Months
77°F (25°C)
Phase Change Thermal Compound
55cc Syringe
-
3.40W/m-K
PSX-D
65-01-GEL37-0180
THERM-A-GAP GEL 37 3.7 W/M-K DIS
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Quantity
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PCB Symbol, Footprint & 3D Model
Blue
Low Outgassing (ASTM E595)
18 Months
-
Silicone Gel
180cc Syringe
-67°F ~ 392°F (-55°C ~ 200°C)
3.70W/m-K
THERM-A-GAP™ GEL 37
253G
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
Indefinite (Unopened)
-
Silicone Compound
10 lb Can
-40°F ~ 399°F (-40°C ~ 204°C)
0.76W/m-K
Thermalcote™
122-30CC
SILICONE GREASE 30CC SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
60 Months
-
Silicone Compound
30cc Syringe
-40°F ~ 401°F (-40°C ~ 205°C)
2.50W/m-K
122
1265LB
THERMAL JOINT COMPOUND (5LB/2.27
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
60 Months
-
Non-Silicone Compound
5 lb Can
-40°F ~ 392°F (-40°C ~ 200°C)
0.69W/m-K
126
860-3.78L
Wire & Wire Management
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
60 Months
50°F ~ 86°F (10°C ~ 30°C)
Silicone Compound
3.78 L Pail
-40°F ~ 392°F (-40°C ~ 200°C)
0.70W/m-K
860
E1208E30CC
SILICONE GREASES 30 CC SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
36 Months ~ 60 Months
-
Silicone Grease
30cc Syringe
-99ºF ~ 500ºF (-73ºC ~ 260ºC)
-
-

About  Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.