Adhesives, Epoxies, Greases, Pastes

Results:
676
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining676
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeTypeUsable Temperature RangeFeaturesStorage/Refrigeration TemperatureColorThermal ConductivitySeriesSize / Dimension
COOLMAG 32 - 10kg PACK
2K Pack : 5kg Resin+5kg Hardene
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Silicone Compound, 2 Part
-129.2°F ~ 300.2°F (-54°C ~ 149°C)
Low Outgassing (ASTM E595), Odorless
68°F ~ 77°F (20°C ~ 25°C)
Cream
1.8W/m-K
Addition Silicone
5 kg Container
COOLMAG SA 10 - 10kg PACK
2K Pack : 5kg Resin+5kg Hardene
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Silicone Compound, 2 Part
-129.2°F ~ 300.2°F (-54°C ~ 149°C)
Low Outgassing (ASTM E595), Odorless
68°F ~ 77°F (20°C ~ 25°C)
Cream
1.10W/m-K
Addition Silicone
5 kg Container
COOLMAG 29 LV - 10kg PACK
2K Pack : 5kg Resin+5kg Hardene
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Silicone Compound, 2 Part
-129.2°F ~ 300.2°F (-54°C ~ 149°C)
Low Outgassing (ASTM E595), Odorless
68°F ~ 77°F (20°C ~ 25°C)
Cream
1.8W/m-K
Addition Silicone
5 kg Container
COOLMAG 29 LV - 40kg PACK
2K Pack : 20kg Resin+20kg Harde
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Silicone Compound, 2 Part
-129.2°F ~ 300.2°F (-54°C ~ 149°C)
Low Outgassing (ASTM E595), Odorless
68°F ~ 77°F (20°C ~ 25°C)
Cream
1.8W/m-K
Addition Silicone
-
DM-TIM-15025-SYP-10
NON-SILICONE GEL/PUTTY 2.5 W/MK
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Non-Silicone Compound
-40°F ~ 257°F (-40°C ~ 125°C)
-
64.4°F ~ 77°F (18°C ~ 25°C)
Gray
2.50W/m-K
DM-TIM
10cc Syringe
COOLMAG 32 - 40kg PACK
2K Pack : 20kg Resin+20kg Harde
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Silicone Compound, 2 Part
-129.2°F ~ 300.2°F (-54°C ~ 149°C)
Low Outgassing (ASTM E595), Odorless
68°F ~ 77°F (20°C ~ 25°C)
Cream
1.8W/m-K
Addition Silicone
-
127-6-10
GREASE 10CC SYRINGE 6W/MK NON-SI
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Non-Silicone Grease
-67°F ~ 392°F (-55°C ~ 200°C)
-
-
Gray
6.00W/m-K
127
10cc Syringe
127-12-10
GREASE 10CC SYRINGE 12W/M-K NON
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Quantity
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PCB Symbol, Footprint & 3D Model
29 Months
Non-Silicone Grease
-58°F ~ 392°F (-50°C ~ 200°C)
-
-
Gray
12.00W/m-K
127
10cc Syringe
DM-TIM-15025-SY-30
NON-SILICONE GEL/PUTTY 2.5 W/MK
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Non-Silicone Compound
-40°F ~ 257°F (-40°C ~ 125°C)
-
64.4°F ~ 77°F (18°C ~ 25°C)
Gray
2.50W/m-K
DM-TIM
30cc Syringe
COOLMAG SA 30 - 40kg PACK
2K Pack : 20kg Resin+20kg Harde
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Silicone Compound, 2 Part
-129.2°F ~ 300.2°F (-54°C ~ 149°C)
Low Outgassing (ASTM E595), Odorless
68°F ~ 77°F (20°C ~ 25°C)
Cream
3.00W/m-K
Addition Silicone
-
DM-TIM-15055-SYP-10
NON-SILICONE GEL/PUTTY 5.5 W/MK
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Non-Silicone Compound
-40°F ~ 257°F (-40°C ~ 125°C)
-
64.4°F ~ 77°F (18°C ~ 25°C)
Gray
5.50W/m-K
DM-TIM
10cc Syringe
DM-TIM-15075-SYP-10
NON-SILICONE THERMAL PUTTY 7.5 W
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Non-Silicone Compound
-40°F ~ 257°F (-40°C ~ 125°C)
-
64.4°F ~ 77°F (18°C ~ 25°C)
Gray
7.50W/m-K
DM-TIM
10cc Syringe
DM-TIM-15045-SYP-10
NON-SILICONE GEL/PUTTY 4.5 W/MK
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Non-Silicone Compound
-40°F ~ 257°F (-40°C ~ 125°C)
-
64.4°F ~ 77°F (18°C ~ 25°C)
Gray
4.50W/m-K
DM-TIM
10cc Syringe
WTP-A50-30ML
Thermal Putty, 5.0W/mk, 30ml
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Silicone Putty
-40°F ~ 392°F (-40°C ~ 200°C)
-
72°F ~ 81°F (22°C ~ 27°C)
Gray, Pink
5.00W/m-K
WTP
30 ml Syringe
DM-TIM-15065-SYP-10
NON-SILICONE GEL/PUTTY 6.5 W/MK
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Non-Silicone Compound
-40°F ~ 257°F (-40°C ~ 125°C)
-
64.4°F ~ 77°F (18°C ~ 25°C)
Gray
6.50W/m-K
DM-TIM
10cc Syringe
DM-TIM-15340-SYP
ONE PART THERMAL EPOXY 3.7 W/MK
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Epoxy Adhesive
-40°F ~ 257°F (-40°C ~ 125°C)
-
39°F ~ 44°F (4°C ~ 7°C)
Gray
3.70W/m-K
DM-TIM
10cc Syringe
DM-TIM-15055-SY-30
NON-SILICONE GEL/PUTTY 5.5 W/MK
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Non-Silicone Compound
-40°F ~ 257°F (-40°C ~ 125°C)
-
64.4°F ~ 77°F (18°C ~ 25°C)
Gray
5.50W/m-K
DM-TIM
30cc Syringe
DM-TIM-15085-SYP-10
NON-SILICONE THERMAL PUTTY 8.5 W
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Non-Silicone Compound
-40°F ~ 257°F (-40°C ~ 125°C)
-
64.4°F ~ 77°F (18°C ~ 25°C)
Gray
8.50W/m-K
DM-TIM
10cc Syringe
WTP-A30-30ML
Thermal Putty, 3.0W/mk, 30ml
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Silicone Putty
-40°F ~ 392°F (-40°C ~ 200°C)
Low Outgassing
72°F ~ 81°F (22°C ~ 27°C)
Blue
3.0W/m-K
WTP
30 ml Syringe
DM-TIM-15075-SY-30
NON-SILICONE THERMAL PUTTY 7.5 W
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Non-Silicone Compound
-40°F ~ 257°F (-40°C ~ 125°C)
-
64.4°F ~ 77°F (18°C ~ 25°C)
Gray
7.50W/m-K
DM-TIM
30cc Syringe

About  Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.