Adhesives, Epoxies, Greases, Pastes

Results:
676
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining676
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ImageProduct DetailPriceAvailabilityECAD ModelFeaturesColorShelf LifeSeriesTypeSize / DimensionUsable Temperature RangeThermal ConductivityStorage/Refrigeration Temperature
GL-60-10
ULTIMIFLUX GEL 10CC SYRINGE 3W/M
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
-
ulTIMiFlux™
Gel Gap Filler
10cc Syringe
-67°F ~ 392°F (-55°C ~ 200°C)
3.00W/m-K
Room Temperature
BT-401-H
SILVER FILLED BONDATHERM 2 GRAM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
12 Months
BondaTherm™
Epoxy, 2 Part
2 gram Hinge Pack
-
-
77°F (25°C)
BT-403-H
ALUMINUM FILLED BONDATHERM EPOXY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
12 Months
BondaTherm™
Epoxy, 2 Part
100 gram Hinge Pack
-
-
-
BT-102-50M-EQZ
TWO DUAL CATRIDGES (BT-102-50M),
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
36 Months
BondaTherm™
Applicator, Epoxy
50 ml Cartridges
-
-
-
BT-101-50M-EQZ
TWO DUAL CATRIDGES (BT-101-50M),
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Clear
36 Months
BondaTherm™
Applicator, Epoxy
50 ml Cartridges
-58°F ~ 266°F (-50°C ~ 130°C)
-
-
BT-301-200M-EQZ
TWO DUAL CARTRIDGES (BT-301-200M
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
36 Months
BondaTherm™
Epoxy (2 Part), Mixing Nozzles (3), Gun
200 ml Cartridges
-40°F ~ 248°F (-40°C ~ 120°C)
1.04W/m-K
-
8329TCM-50ML
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
36 Months
8329TCM
Epoxy, 2 Part
50 ml Can
-40°F ~ 302°F (-40°C ~ 150°C)
1.40W/m-K
50°F ~ 86°F (10°C ~ 30°C)
TG6060-D-30CC
SILICONE PUTTY 30CC SYRINGE BLUE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Blue
12 Months
TG6060
Silicone Putty
30cc Syringe
-58°F ~ 356°F (-50°C ~ 180°C)
6.30W/m-K
-
860-1P
HEAT TRANS COMPOUND SILICONE
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Quantity
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PCB Symbol, Footprint & 3D Model
Odorless
White
60 Months
-
Silicone Compound
2.5 lb Jar
-40°F ~ 392°F (-40°C ~ 200°C)
0.66W/m-K
50°F ~ 86°F (10°C ~ 30°C)
TG6060-D-55CC
SILICONE PUTTY 55CC SYRINGE BLUE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Blue
12 Months
TG6060
Silicone Putty
55cc Syringe
-58°F ~ 356°F (-50°C ~ 180°C)
6.30W/m-K
-
TG-S808-55CC
THERMAL GREASE 55CC SYRINGE GREY
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Quantity
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PCB Symbol, Footprint & 3D Model
Low Outgassing (ASTM E595)
Gray
18 Months
TG-S808
Silicone Grease
55cc Syringe
-40°F ~ 392°F (-40°C ~ 200°C)
8.00W/m-K
25°C or Below
TG-A09AB-1000
SILICONE POTTING COMPOUND 1KG GR
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Quantity
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PCB Symbol, Footprint & 3D Model
Low Outgassing (ASTM E595)
Gray
12 Months
TG-A09AB
Potting Compound, 2 Part
1 kg Container
-13°F ~ 300°F (-25°C ~ 150°C)
2.80W/m-K
25°C or Below
860-4G
HEAT TRANS COMPOUND SILICONE
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Quantity
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PCB Symbol, Footprint & 3D Model
Odorless
White
60 Months
-
Silicone Compound
100 (4 gram) Singles
-40°F ~ 392°F (-40°C ~ 200°C)
0.66W/m-K
50°F ~ 86°F (10°C ~ 30°C)
BT-301-50M
FAST CURING THERMALLY CONDUCTIVE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
12 Months
BondaTherm™
Epoxy, 2 Part
50 ml Cartridges
-40°F ~ 248°F (-40°C ~ 120°C)
1.04W/m-K
-
8329TFF-25ML
FAST CURE THERM COND ADH FLOW
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Beige
36 Months
8329TFF
Epoxy, 2 Part
25 ml Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
0.80W/m-K
50°F ~ 86°F (10°C ~ 30°C)
TC2810 50ML
ADHESIVE 2-PART EPOXY 50ML
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Cream
12 Months
TC-2810
Epoxy, 2 Part
50 ml Cartridges
-
0.80 ~ 1.40W/m-K
70°F (21°C)
4952G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
12 Months
Thermalbond™
Hardener Epoxy
7 oz Package
-85°F ~ 311°F (-65°C ~ 155°C)
1.34W/m-K
-
860-60G
HEAT TRANS COMPOUND SILICONE
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Quantity
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PCB Symbol, Footprint & 3D Model
Odorless
White
60 Months
-
Silicone Compound
2 oz Jar
-40°F ~ 392°F (-40°C ~ 200°C)
0.66W/m-K
50°F ~ 86°F (10°C ~ 30°C)
HSC67-6G
SILICONE HEAT SINK COMPOUND SQUE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
60 Months
-
Silicone Compound
6 gram Tube
-
0.67W/m-K
-
BT-102-50M
TOUGHENED, FLEXIBLE ADHESIVE SYS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
12 Months
BondaTherm™
Epoxy, 2 Part
50 ml Cartridges
-
-
-

About  Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.