Adhesives, Epoxies, Greases, Pastes

Results:
676
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining676
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ImageProduct DetailPriceAvailabilityECAD ModelFeaturesColorStorage/Refrigeration TemperatureTypeSize / DimensionUsable Temperature RangeThermal ConductivityShelf LifeSeries
249G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
-
Silicone Compound
1.0 oz. Tube
-40°F ~ 399°F (-40°C ~ 204°C)
0.76W/m-K
Indefinite (Unopened), 12 Months (Opened)
Thermalcote™
126-2
NONSILICONE GREASE 2OZ JAR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
-
Non-Silicone Compound
2 oz Jar
-40°F ~ 392°F (-40°C ~ 200°C)
0.69W/m-K
60 Months
126
252G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
-
Silicone Compound
5 lb Can
-40°F ~ 399°F (-40°C ~ 204°C)
0.76W/m-K
Indefinite (Unopened), 12 Months (Opened)
Thermalcote™
126-4S
NONSILICONE GREASE 4OZ SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
-
Non-Silicone Compound
4 oz Syringe
-40°F ~ 392°F (-40°C ~ 200°C)
0.69W/m-K
60 Months
126
TT4000
NANO THERMAL GREASE, 5G IN A SYR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
25°C or Below
Silicone Grease
5 gram Syringe
-60°C ~ 180°C
8.00W/m-K
60 Months
LiPOLY® TT4000
8616-85ML
SUPER THERMAL GREASE
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Quantity
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PCB Symbol, Footprint & 3D Model
Odorless
White
50°F ~ 86°F (10°C ~ 30°C)
Non-Silicone Grease
85 ml Tube
-90°F ~ 329°F (-68°C ~ 165°C)
1.78W/m-K
60 Months
-
TC-2707 50ML
ADHESIVE THERM COND 50ML
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
-
Epoxy, 2 Part
50 ml Cartridges
-
0.72W/m-K
12 Months
TC-2707
832TC-450ML
THERMALLY CONDUCTIVE EPOXY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Black
50°F ~ 86°F (10°C ~ 30°C)
Epoxy, 2 Part
450 ml Kit
-22°F ~ 347°F (-30°C ~ 175°C)
0.68W/m-K
60 Months
832TC
234476
3873 SELF SHIM HI COND THERM ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
41°F (5°C)
Acrylic Adhesive (Activator Sold Separately)
25 ml Syringe
-
1.25W/m-K
21 Months
LOCTITE® 3873™
8329TCM-6ML
ADHESIVE - THERMAL CONDUCTIVE EP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
50°F ~ 86°F (10°C ~ 30°C)
Epoxy, 2 Part
6 ml Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
1.40W/m-K
36 Months
8329TCM
1586134
ECCOBOND 56C-CAT 9 KIT, 140.5GM
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Quantity
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PCB Symbol, Footprint & 3D Model
Low Outgassing (ASTM E595)
Silver
64.4°F ~ 77°F (18°C ~ 25°C)
Epoxy, 2 Part
140.5 grams
-76°F ~ 248°F (-60°C ~ 120°C)
3.00W/m-K
12 Months
-
BT-101-50M
NON-SAG 5 MINUTE BONDATHERM EPOX
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Clear
-
Epoxy, 2 Part
50 ml Cartridges
-58°F ~ 266°F (-50°C ~ 130°C)
-
36 Months
BondaTherm™
BT-103-50M
5 MINUTE CLEAR BONDATHERM EPOXY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Clear
-
Epoxy, 2 Part
50 ml Cartridges
-58°F ~ 266°F (-50°C ~ 130°C)
-
12 Months
BondaTherm™
8616-25ML
SUPER THERMAL GREASE
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Quantity
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PCB Symbol, Footprint & 3D Model
Odorless
White
50°F ~ 86°F (10°C ~ 30°C)
Non-Silicone Grease
25 ml Jar
-90°F ~ 329°F (-68°C ~ 165°C)
1.78W/m-K
60 Months
-
8329TFF-50ML
FAST CURE THERM COND ADH FLOW
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Beige
50°F ~ 86°F (10°C ~ 30°C)
Epoxy, 2 Part
45 ml Cartridge
-40°F ~ 302°F (-40°C ~ 150°C)
0.80W/m-K
36 Months
8329TFF
8329-350G
EPOXY MOLD RELEASE (NON SILICONE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 86°F (10°C ~ 30°C)
Non-Silicone Compound
12.3 oz Tube
500°F (260°C)
-
60 Months
8329
1379310
CATALYST 9 (27G)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Black
-
Catalyst
-
-40°F ~ 266°F (-40°C ~ 130°C)
-
18 Months
STYCAST™ 2651™
HTS02S
SILICONE HEATSINK PASTE 2ML
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
Silicone Compound
2 ml Syringe
-
-
-
-
P0200-20
COMPOUND HEAT SINK 2OZ JAR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
Non-Silicone Compound
100 gram Jar
-
-
12 Months
P0200
BT-301-200M
FAST CURING THERMALLY CONDUCTIVE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
-
Epoxy, 2 Part
200 ml Cartridges
-40°F ~ 248°F (-40°C ~ 120°C)
1.04W/m-K
36 Months
BondaTherm™

About  Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.