Socket Adapters

Results:
279
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
Results remaining279
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
228-1277-09-0602J
SOCKET ADAPTER 28DIP TO 28DIP
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
28-651000-11-RC
SOCKET ADAPTER SSOP TO 28DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 651000
SSOP
DIP, 0.6" (15.24mm) Row Spacing
28
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
224-5248-09-0602J
RECEPTACLE DIP SOCKET 24POS .3"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-5248-19-0602J
RECEPTACLE DIP SOCKET 24POS .3"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
228-1277-29-0602J
RECEPTACLE DIP SOCKET 28POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
32-650000-11-RC
SOCKET ADAPTER SOJ TO 32DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 650000
SOJ
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
240-3639-09-0602J
RECEPTACLE DIP SOCKET 40POS 1.0"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 1.0" (25.40mm) Row Spacing
DIP, 1.0" (25.40mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
32-450001-10
SOCKET ADAPTER SOJ TO 32DIP 0.4
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 450001
SOJ
DIP, 0.4" (10.16mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
FR4 Epoxy Glass
242-1281-19-0602J
RECEPTACLE DIP SOCKET 42POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
68-653000-11-RC
SOCKET ADAPTER PLCC TO 68DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
68
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
242-1281-39-0602J
RECEPTACLE DIP SOCKET 42POS .6"
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
84-652000-11-RC
SOCKET ADAPTER PLCC TO 84DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 652000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
84
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
800-3-6-1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
68-304538-10
SOCKET ADAPTER PLCC TO 68PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 304538
PLCC
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
1109342
ADAPTER PLCC TO DIP
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1109342
PLCC
DIP, 0.6" (15.24mm) Row Spacing
44
-
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
Polyphenylene Sulfide (PPS)
FR4 Epoxy Glass
44-652000-10
SOCKET ADAPTER PLCC TO 44DIP 0.6
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 652000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
44
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
264-1300-29-0602J
RECEPTACLE DIP SOCKET 64POS .8"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.8" (20.32mm) Row Spacing
DIP, 0.8" (20.32mm) Row Spacing
64
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
290-1294-09-0602J
RECEPTACLE DIP SOCKET 90POS .9"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.9" (22.86mm) Row Spacing
DIP, 0.9" (22.86mm) Row Spacing
90
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
28-650000-10-P
SOCKET ADAPTER SOIC TO 28DIP 0.6
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 650000
SOIC
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
84-653000-10
SOCKET ADAPTER PLCC TO 84DIP 0.6
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
84
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass

About  Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.