X2Y® Series, Ceramic Capacitors

Results:
283
Manufacturer
Series
Capacitance
Size / Dimension
Thickness (Max)
Voltage - Rated
Package / Case
Tolerance
Temperature Coefficient
Operating Temperature
Features
Applications
Height - Seated (Max)
Lead Spacing
Mounting Type
Ratings
Failure Rate
Lead Style
Results remaining283
Applied Filters:
X2Y®
Select
ImageProduct DetailPriceAvailabilityECAD ModelHeight - Seated (Max)ToleranceCapacitanceOperating TemperatureRatingsPackage / CaseVoltage - RatedTemperature CoefficientMounting TypeSeriesApplicationsFeaturesLead StyleFailure RateSize / DimensionThickness (Max)Lead Spacing
500X07W101MV4T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
100 pF
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
500X41W224MV4E
CAP CER 0.22UF 50V X7R 1210
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.22 µF
-55°C ~ 125°C
-
1210 (3225 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.125" L x 0.098" W (3.18mm x 2.49mm)
0.070" (1.78mm)
-
101X15N100MV4E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
101X41W334MV4E
CAP CER 0.33UF 100V X7R 1210
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.33 µF
-55°C ~ 125°C
-
1210 (3225 Metric)
100V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.125" L x 0.098" W (3.18mm x 2.49mm)
0.070" (1.78mm)
-
500X15N331MF4
CAP CER 330PF 50V 20% NP0 0805
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
330 pF
-55°C ~ 125°C
-
0805 (2012 Metric)
50V
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
500X44W404MV4E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.4 µF
-55°C ~ 125°C
-
1410 (3524 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.140" L x 0.098" W (3.56mm x 2.49mm)
0.070" (1.78mm)
-
101X44W404MV4E
CAP CER 0.4UF 100V X7R 1410
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.4 µF
-55°C ~ 125°C
-
1410 (3524 Metric)
100V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.140" L x 0.098" W (3.56mm x 2.49mm)
0.070" (1.78mm)
-
500X15W223MV4E
CAP CER 0.022UF 50V X7R 0805
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.022 µF
-55°C ~ 125°C
-
0805 (2012 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
100X14X334MV4T
CAP CER 0.33UF 10V X5R 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.33 µF
-55°C ~ 85°C
-
0603 (1608 Metric)
10V
X5R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
101X14N220MV4T
CAP CER 22PF 100V C0G/NP0 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
22 pF
-55°C ~ 125°C
-
0603 (1608 Metric)
100V
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
500X07W222MV4T
CAP CER 2200PF 50V X7R 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
2200 pF
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
101X18N102MV4E
CAP CER 1000PF 100V C0G/NP0 1206
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
1000 pF
-55°C ~ 125°C
-
1206 (3216 Metric)
100V
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.124" L x 0.063" W (3.15mm x 1.60mm)
0.050" (1.27mm)
-
500X14W472MV4T
CAP CER 4700PF 50V X7R 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
4700 pF
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
160X07W103MV4T
CAP CER 10000PF 16V X7R 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
10000 pF
-55°C ~ 125°C
-
0402 (1005 Metric)
16V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
101X15N220MV4E
CAP CER 22PF 100V C0G/NP0 0805
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
22 pF
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
101X15W103MV4E
CAP CER 10000PF 100V X7R 0805
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
10000 pF
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
6R3X14W104MV4T
CAP CER 0.1UF 6.3V X7R 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.1 µF
-55°C ~ 125°C
-
0603 (1608 Metric)
6.3V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
6R3X14W224MV4T
CAP CER 0.22UF 6.3V X7R 0603
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
0.22 µF
-55°C ~ 125°C
-
0603 (1608 Metric)
6.3V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
500X07N101MV4T
CAP CER 100PF 50V C0G/NP0 0402
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
100 pF
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
101X14W222MV4T
CAP CER 2200PF 100V X7R 0603
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
2200 pF
-55°C ~ 125°C
-
0603 (1608 Metric)
100V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-

About  Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.