X2Y® Series, Ceramic Capacitors

Results:
283
Manufacturer
Series
Capacitance
Size / Dimension
Thickness (Max)
Voltage - Rated
Package / Case
Tolerance
Temperature Coefficient
Operating Temperature
Features
Applications
Height - Seated (Max)
Lead Spacing
Mounting Type
Ratings
Failure Rate
Lead Style
Results remaining283
Applied Filters:
X2Y®
Select
ImageProduct DetailPriceAvailabilityECAD ModelHeight - Seated (Max)ToleranceOperating TemperatureRatingsPackage / CaseVoltage - RatedCapacitanceTemperature CoefficientMounting TypeSeriesApplicationsFeaturesLead StyleFailure RateSize / DimensionThickness (Max)Lead Spacing
500X15N471MV4E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
50V
470 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
500X07N1R8DV4T
CAP CER 1.8PF 50V C0G/NP0 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±0.5pF
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
1.8 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
500X07W472MV4T
CAP CER 4700PF 50V X7R 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
4700 pF
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
500X07N100MV4T
CAP CER 10PF 50V C0G/NP0 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
10 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
500X07N5R6DV4T
CAP CER 5.6PF 50V C0G/NP0 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±0.5pF
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
5.6 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
500X14N221MV4T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
220 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
CX0805MRNPO9BB470
CAP CER 47PF 50V NPO 0805
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
50V
47 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.037" (0.95mm)
-
CX0805MRNPO9BB220
CAP CER 22PF 50V NPO 0805
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
50V
22 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.037" (0.95mm)
-
101X15N121MV4E
CAP CER 120PF 100V NP0 0805
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
120 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
101X15N221MV4E
CAP CER 220PF 100V NP0 0805
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
220 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
500X14W102MV4T
CAP CER 1000PF 50V X7R 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
1000 pF
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
101X15N270MV4E
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
27 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
500X07N470MV4T
CAP CER 47PF 50V C0G/NP0 0402
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
47 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
500X41W104MV4E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
1210 (3225 Metric)
50V
0.1 µF
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.125" L x 0.098" W (3.18mm x 2.49mm)
0.070" (1.78mm)
-
101X15N470MV4E
CAP CER 47PF 100V C0G/NP0 0805
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
47 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
160X18W224MV4E
CAP CER 0.22UF 16V X7R 1206
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
1206 (3216 Metric)
16V
0.22 µF
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.124" L x 0.063" W (3.15mm x 1.60mm)
0.050" (1.27mm)
-
101X14W472MV4T
CAP CER 4700PF 100V X7R 0603
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0603 (1608 Metric)
100V
4700 pF
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
500X14N5R6DV4T
CAP CER 5.6PF 50V C0G/NP0 0603
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±0.5pF
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
5.6 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
500X14N5R0DV4T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±0.5pF
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
5 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
101X14N5R6DV4T
CAP CER 5.6PF 100V C0G/NP0 0603
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±0.5pF
-55°C ~ 125°C
-
0603 (1608 Metric)
100V
5.6 pF
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-

About  Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.