Minitek® 2.00mm Series, Board Spacers, Stackers (Board to Board)

Results:
576
Manufacturer
Series
Length - Stack Height
Length - Post (Mating)
Number of Positions
Length - Overall Pin
Length - Tail
Contact Finish Thickness - Post (Mating)
Contact Finish - Post (Mating)
Number of Rows
Color
Termination
Row Spacing
Mounting Type
Pitch
Results remaining576
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Minitek® 2.00mm
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeTerminationNumber of RowsColorSeriesPitchNumber of PositionsRow SpacingLength - Overall PinLength - Post (Mating)Length - Stack HeightLength - TailContact Finish - Post (Mating)Contact Finish Thickness - Post (Mating)
59202-T26-06A055LF
CONN HDR 12P 0.079" STACK SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
12
0.079" (2.00mm)
0.335" (8.500mm)
0.118" (3.000mm)
0.217" (5.500mm)
-
Gold
30.0µin (0.76µm)
98426-G06-04-148LF
CONN HDR 8POS 0.079" STACK T/H
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black and Cream
Minitek® 2.00mm
0.079" (2.00mm)
8
0.079" (2.00mm)
0.673" (17.100mm)
0.157" (4.000mm)
0.417" (10.600mm)
0.091" (2.300mm)
Gold, GXT™
30.0µin (0.76µm)
59112-T36-06-118LF
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
12
0.079" (2.000mm)
0.673" (17.094mm)
0.110" (2.794mm)
0.465" (11.800mm)
0.098" (2.50mm)
Gold
30.0µin (0.76µm)
59132-T36-06-100LF
CONN HDR 12POS 0.079" STACK TH
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
12
0.079" (2.00mm)
0.673" (17.100mm)
0.161" (4.100mm)
0.394" (10.000mm)
0.118" (3.000mm)
Gold
30.0µin (0.76µm)
59132-G28-14-050LF
CONN HDR 28POS 0.079" STACK TH
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
28
0.079" (2.00mm)
0.465" (11.800mm)
0.150" (3.800mm)
0.197" (5.000mm)
0.118" (3.000mm)
Gold
30.0µin (0.76µm)
59112-F40-08-135LF
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
16
0.079" (2.000mm)
0.831" (21.100mm)
0.201" (5.105mm)
0.531" (13.487mm)
0.098" (2.50mm)
Gold
8.00µin (0.203µm)
59112-G36-13-115LF
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
26
0.079" (2.000mm)
0.673" (17.094mm)
0.122" (3.099mm)
0.453" (11.506mm)
0.098" (2.50mm)
Gold
30.0µin (0.76µm)
59132-G32-25-070
CONN HDR 50POS 0.079" STACK TH
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
50
0.079" (2.00mm)
0.555" (14.100mm)
0.161" (4.100mm)
0.276" (7.000mm)
0.118" (3.000mm)
Gold
30.0µin (0.76µm)
59202-G40-07-174LF
CONN HDR 14P 0.079" STACK SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
14
0.079" (2.00mm)
0.764" (19.400mm)
0.079" (2.000mm)
0.685" (17.400mm)
-
Gold
30.0µin (0.76µm)
59112-G34-25-111LF
CONN HDR 50POS 0.079" STACK TH
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
50
0.079" (2.00mm)
0.555" (14.100mm)
0.020" (0.508mm)
0.437" (11.100mm)
0.098" (2.500mm)
Gold
30.0µin (0.76µm)
59202-G38-20A135LF
CONN HDR 40P 0.079" STACK SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
40
0.079" (2.00mm)
0.685" (17.400mm)
0.154" (3.900mm)
0.531" (13.500mm)
-
Gold
30.0µin (0.76µm)
59112-T34-06-109LF
CONN HDR 12POS 0.079" STACK TH
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
12
0.079" (2.00mm)
0.555" (14.100mm)
0.028" (0.711mm)
0.429" (10.900mm)
0.098" (2.500mm)
Gold
30.0µin (0.76µm)
59112-G28-07-045LF
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
14
0.079" (2.000mm)
0.465" (11.800mm)
0.189" (4.800mm)
0.177" (4.496mm)
0.098" (2.50mm)
Gold
30.0µin (0.76µm)
59112-T32-10-084LF
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
20
0.079" (2.000mm)
0.555" (14.097mm)
0.126" (3.200mm)
0.331" (8.400mm)
0.098" (2.50mm)
Gold
30.0µin (0.76µm)
98426-G12-10-210LF
CONN HDR 20POS 0.079" STACK T/H
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black and Cream
Minitek® 2.00mm
0.079" (2.00mm)
20
0.079" (2.00mm)
0.917" (23.300mm)
0.157" (4.000mm)
0.661" (16.800mm)
0.091" (2.300mm)
Gold, GXT™
30.0µin (0.76µm)
98426-G16-07-297LF
CONN HDR 14POS 0.079" STACK T/H
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black and Cream
Minitek® 2.00mm
0.079" (2.00mm)
14
0.079" (2.00mm)
1.260" (32.000mm)
0.157" (4.000mm)
1.004" (25.500mm)
0.091" (2.300mm)
Gold, GXT™
30.0µin (0.76µm)
59132-F38-10-127LF
CONN HDR 20POS 0.079" STACK TH
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
20
0.079" (2.00mm)
0.752" (19.100mm)
0.134" (3.400mm)
0.500" (12.700mm)
0.118" (3.000mm)
Gold
8.00µin (0.203µm)
98426-G10-10-188LF
CONN HDR 20POS 0.079" STACK T/H
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black and Cream
Minitek® 2.00mm
0.079" (2.00mm)
20
0.079" (2.00mm)
0.831" (21.100mm)
0.157" (4.000mm)
0.575" (14.600mm)
0.091" (2.300mm)
Gold, GXT™
30.0µin (0.76µm)
59112-F40-05-140LF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
10
0.079" (2.000mm)
0.831" (21.100mm)
0.181" (4.597mm)
0.551" (13.995mm)
0.098" (2.50mm)
Gold
8.00µin (0.203µm)
59112-S34-08-099LF
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
Solder
2
Black
Minitek® 2.00mm
0.079" (2.00mm)
16
0.079" (2.000mm)
0.614" (15.596mm)
0.126" (3.200mm)
0.390" (9.900mm)
0.098" (2.50mm)
Gold
15.0µin (0.38µm)

About  Board Spacers, Stackers (Board to Board)

Rectangular header connectors are specifically designed to establish connections between circuits on different printed circuit boards (PCBs), ensuring electrical insulation and proper board spacing. These connectors are chosen based on their pitch, stack height, number of positions, and rows. The pitch refers to the distance between the centers of adjacent pins or contacts on the connector. It determines the compatibility and alignment between the header and its mating connector. Different applications may require different pitch sizes to accommodate specific PCB designs and requirements. Stack height refers to the vertical distance between the top and bottom surfaces of the connector. It is crucial for maintaining proper clearance between the PCBs when they are connected using these headers. Selecting the appropriate stack height ensures that the assembled boards fit securely and function optimally. Header connectors come in various configurations with different numbers of positions and rows. The number of positions refers to the total number of individual contacts or pins on the connector. This determines the number of electrical connections that can be established between the PCBs. The number of rows indicates whether the contacts are arranged in a single row or multiple rows on the connector. These connectors are typically soldered onto the PCB, providing a secure and reliable connection. They are available in both surface mount and through-hole versions, allowing for flexibility in assembly processes and compatibility with different PCB types. Regarding the plating options, header connectors can come with gold, tin, or tin-lead plating. The plating material is chosen based on factors such as cost, conductivity, and environmental considerations. Gold plating offers excellent corrosion resistance and reliable electrical performance. Tin and tin-lead plating options are more cost-effective alternatives but may require additional measures to mitigate potential issues like tin whisker growth. In summary, rectangular header connectors play a crucial role in connecting circuits on separate PCBs while providing insulation and proper board spacing. Their selection depends on factors such as pitch, stack height, number of positions, and rows. These connectors are soldered onto the PCB and are available in surface mount and through-hole versions, with various plating options to suit different application requirements.