Seeed

Seeed

Seeed is a renowned open hardware innovation platform that provides accessible and flexible development resources for creators, makers, and startups. Established in 2008, the company offers a wide range of products and services, including development boards, sensors, IoT solutions, and manufacturing services. Seeed's Seeed Fusion service provides comprehensive PCB fabrication and assembly solutions, catering to diverse prototyping and production needs. The company also operates the Seeed Studio platform, which serves as a hub for sharing hardware projects, tutorials, and resources, fostering collaboration and knowledge exchange within the maker community. Seeed is committed to enabling innovation by simplifying the process of turning ideas into reality, empowering individuals and businesses to bring their creations to life. With a strong focus on open-source values and community engagement, Seeed continues to be a driving force in the advancement of open hardware and IoT technologies.

Adapter, Breakout Boards

Results:
7
Series
Package Accepted
Pitch
Size / Dimension
Number of Positions
Proto Board Type
Material
Board Thickness
Results remaining7
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesBoard ThicknessMaterialPitchProto Board TypePackage AcceptedNumber of PositionsSize / Dimension
319010042
QFP SURFACE MOUNT PROTOBOARD 0.8
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
0.020" (0.50mm)
SMD to Plated Through Hole Board
SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP
6, 8
3.937" L x 3.150" W (100.00mm x 80.00mm)
319010045
XQFP BREAKOUT BOARD 0.65MM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
0.026" (0.65mm)
SMD to Plated Through Hole Board
QFP
80
1.575" L x 1.575" W (40.00mm x 40.00mm)
319010047
QFP SURFACE MOUNT PROTOBOARD 0.5
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
0.020" (0.50mm)
SMD to Plated Through Hole Board
SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP
6, 8
3.937" L x 3.150" W (100.00mm x 80.00mm)
319010352
XQFP BREAKOUT BOARD 0.5MM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
0.020" (0.50mm)
SMD to Plated Through Hole Board
QFP
80
1.575" L x 1.575" W (40.00mm x 40.00mm)
319010351
XQFP BREAKOUT BOARD 0.8MM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
0.031" (0.80mm)
SMD to Plated Through Hole Board
QFP
80
1.575" L x 1.575" W (40.00mm x 40.00mm)
319010053
QFP SURFACE MOUNT PROTOBOARD 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
0.026" (0.65mm)
SMD to Plated Through Hole Board
SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP
6, 8
3.937" L x 3.150" W (100.00mm x 80.00mm)
319010458
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0.031" (0.80mm)
SMD to Plated Through Hole
-
80
-

About  Adapter, Breakout Boards

The products in this category are designed to facilitate easier access to the electrical contacts of connectors, integrated circuits, or similar devices. They achieve this by creating connections between a component placement area, which is usually intended for fine-pitch, surface-mounted integrated circuits, and an interconnect area with a considerably larger distance between pin centers. The main purpose of these products is to simplify the process of interconnecting these two areas, thereby improving the efficiency of prototyping and testing electronic components. One typical use case involves enabling the use of solderless breadboards as a prototyping method for components that do not come in breadboard-compatible packaging. By utilizing these accessories, engineers and designers can quickly and easily establish connections between various components without the need for soldering or additional wiring. This streamlines the prototyping process and reduces the time and effort required. These products are available in a variety of configurations, including headers, sockets, and adapters, to accommodate different types of connectors and devices. In summary, products in this category offer a practical and efficient solution for accessing the electrical contacts of connectors and integrated circuits, enabling smoother prototyping and testing of electronic components.