Correct-A-Chip® 351000 Series, Adapter, Breakout Boards

Results:
7
Manufacturer
Series
Size / Dimension
Number of Positions
Material
Package Accepted
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Board Thickness
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Correct-A-Chip® 351000
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesNumber of PositionsMaterialPitchBoard ThicknessProto Board TypePackage AcceptedSize / Dimension
16-351000-10
SOCKET ADAPTER SSOP TO 16DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
16
FR4 Epoxy Glass
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
SMD to DIP
SSOP
1.800" L x 0.400" W (45.72mm x 10.16mm)
28-351000-10
SOCKET ADAPTER SSOP TO 28DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
28
FR4 Epoxy Glass
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
SMD to DIP
SSOP
2.800" L x 0.400" W (71.12mm x 10.16mm)
28-351000-11-RC
SOCKET ADAPTER SSOP TO 28DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
28
-
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
SMD to DIP
SSOP
2.800" L x 0.400" W (71.12mm x 10.16mm)
20-351000-11-RC
SOCKET ADAPTER SSOP TO 20DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
20
-
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
SMD to DIP
SSOP
2.000" L x 0.400" W (50.80mm x 10.16mm)
16-351000-11-RC
SOCKET ADAPTER SSOP TO 16DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
16
-
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
SMD to DIP
SSOP
1.600" L x 0.400" W (40.64mm x 10.16mm)
14-351000-11-RC
SOCKET ADAPTER SSOP TO 14DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
14
-
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
SMD to DIP
SSOP
1.400" L x 0.400" W (35.56mm x 10.16mm)
14-351000-10
SOCKET ADAPTER SSOP TO 14DIP 0.3
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
14
FR4 Epoxy Glass
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
SMD to DIP
SSOP
1.400" L x 0.400" W (35.56mm x 10.16mm)

About  Adapter, Breakout Boards

The products in this category are designed to facilitate easier access to the electrical contacts of connectors, integrated circuits, or similar devices. They achieve this by creating connections between a component placement area, which is usually intended for fine-pitch, surface-mounted integrated circuits, and an interconnect area with a considerably larger distance between pin centers. The main purpose of these products is to simplify the process of interconnecting these two areas, thereby improving the efficiency of prototyping and testing electronic components. One typical use case involves enabling the use of solderless breadboards as a prototyping method for components that do not come in breadboard-compatible packaging. By utilizing these accessories, engineers and designers can quickly and easily establish connections between various components without the need for soldering or additional wiring. This streamlines the prototyping process and reduces the time and effort required. These products are available in a variety of configurations, including headers, sockets, and adapters, to accommodate different types of connectors and devices. In summary, products in this category offer a practical and efficient solution for accessing the electrical contacts of connectors and integrated circuits, enabling smoother prototyping and testing of electronic components.