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Manufacturer:
STMicroelectronicsDescription:
HIGH POWER DENSITY 600V HALF BRI
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Attributes
Technical Documents
| TYPE | DESCRIPTION |
|---|---|
| Manufacturer | STMicroelectronics |
| Features | Bootstrap Circuit |
| Package / Case | 31-VQFN Exposed Pad |
| Mounting Type | Surface Mount |
| Interface | Logic |
| Operating Temperature | -40°C ~ 125°C |
| Output Configuration | Half Bridge |
| Voltage - Supply | 3.3V ~ 15V |
| Rds On (Typ) | 225mOhm LS, 225mOhm HS |
| Applications | General Purpose |
| Current - Output / Channel | 6.5A |
| Current - Peak Output | 6.5A |
| Voltage - Load | 3.3V ~ 15V |
| Supplier Device Package | 31-QFN (9x9) |
| Fault Protection | Over Temperature, UVLO |
| Load Type | Capacitive and Resistive |
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