PANJIT its M4 and M8 series bridge rectifiers, which provide exceptional current rating capabilities and outstanding performance across various applications. These standard-type diode rectifiers are designed to handle voltages up to 1,000 V and come in a range of current ratings from 2 A to 10 A, ensuring efficient power conversion. With excellent heat dissipation properties, they are reliable and can operate under demanding conditions.
The M4 and M8 series bridge rectifiers are built with top-quality materials and adhere to strict environmental standards. They feature matte-tin plating and glass-passivated chip junction, making them lead-free in compliance with the EU RoHS 2.0 directive. Additionally, they are halogen-free according to the IEC 61249 standard, further ensuring their environmental friendliness. The design of the lead frame maximizes the die pad and IFSM (surge forward current) capability, enhancing the overall performance of these rectifiers.
PANJIT takes pride in exceeding industry requirements with its bridge rectifier products. The M4 and M8 series have been meticulously designed to enhance soldering stability and minimize void rates during the manufacturing process. Upgraded die pads, SMD gull-wing packaging, and solder-paste printing techniques are employed, resulting in improved soldering quality and a void rate of less than 15%. This attention to detail ensures reliable and durable connections.
To guarantee top-tier quality, PANJIT employs advanced automated manufacturing processes. Automatic laser die-cutting technology is utilized for precise cutting, while pick-and-place automation ensures accurate die attachment, preventing issues like die shifts, micro-cracks, and chipping. The wafers are produced using SIPOS/PG/LTO (Silicon Oxide Passivation/Silicon Nitride Plasma Gate/Liquid Phase Oxidation) technology, optimizing the rectifiers' HTRB (High-Temperature Reverse Bias) capability.
All M4 and M8 products undergo rigorous testing and are UL certified, meeting the highest safety standards (file number E526209). To streamline the testing process, an automated barcode system is employed for efficient PAT (Product Acceptance Testing) specification review.
With PANJIT's bridge rectifiers, users can achieve maximum forward current ratings within a compact package size. These rectifiers are available in seven different packaging options, providing flexibility for various application requirements. They are particularly well-suited for high-current and high-power applications such as industrial server power, computing, desktop power supplies, game console power, home appliance power boards, rice cookers, microwaves, quick chargers, USB PDs (Power Delivery), air conditioner power boards, and more. Whether it's for professional or consumer electronics, PANJIT's bridge rectifiers deliver exceptional performance and reliable power conversion.
Glass-passivated chip junction
Lead-free in compliance with EU RoHS 2.0
Lead frame is designed to maximize the die pad and IFSM capability of the same packaging size
Halogen-free according to IEC 61249 standard
Matte-tin plating
Automatic laser die-cutting technology
Pick-and-place automation for die attach increases accuracy and prevents die shifts, micro-cracks, and chipping
Automated testing barcode system for PAT spec review
Solder paste printing instead of dispensing during the die-bonding process improves soldering stability and lowers void rate to under 15%
SMD gull-wing packaging
Upgraded die pad
UL certification file number E526209
Wafer produced with SIPOS/PG/LTO technology to optimize HTRB capability
Computing or desktop power
Game console power
Server power
Air conditioner power boards
QC/USB PDs
High-power and high-efficiency power
Home appliance power boards
Rice/IH/microwave cookers
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