Thermal - Heat Pipes, Vapor Chambers

Results:
1,310
Results remaining:1,310
Select
ImageProduct DetailPriceAvailabilityECAD ModelLengthSeriesTypeAttachment MethodShapePower - CoolingThermal ResistanceWick TypeWidthHeightMaterialFeaturesOperating TemperatureDiameterPlatform
126798
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.506" (12.86mm)
0.413" (10.50mm)
Copper
-
-
-
-
HP-CWS-R10-266-K
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
10.472" (266.00mm)
-
Heat Pipe
Epoxy or Solder
Round
103.0W @ 266mm
-
Sintered
-
-
Copper
-
-55°C ~ 180°C
0.394" (10.00mm) OD
-
126567
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
126252
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
13.780" (350.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.528" (13.42mm)
0.157" (4.00mm)
Copper
-
-
-
-
126261
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.652" (16.57mm)
0.157" (4.00mm)
Copper
-
-
-
-
126750
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.540" (13.71mm)
0.354" (9.00mm)
Copper
-
-
-
-
126786
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.517" (13.14mm)
0.394" (10.00mm)
Copper
-
-
-
-
126576
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
126408
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
126810
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.495" (12.57mm)
0.433" (11.00mm)
Copper
-
-
-
-
126678
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.585" (14.85mm)
0.276" (7.00mm)
Copper
-
-
-
-
126359
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
126774
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.529" (13.43mm)
0.374" (9.50mm)
Copper
-
-
-
-
126822
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.484" (12.29mm)
0.453" (11.50mm)
Copper
-
-
-
-
126644
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
126450
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
126492
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
126310
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
126702
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.562" (14.28mm)
0.315" (8.00mm)
Copper
-
-
-
-
126726
FLATTENED, COPPER HEATPIPE, SINT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
7.874" (200.00mm)
-
Heat Pipe
Epoxy or Solder
Flat
-
-
Sintered
0.551" (14.00mm)
0.335" (8.50mm)
Copper
-
-
-
-

Thermal - Heat Pipes, Vapor Chambers

Thermal heat pipes and vapor chambers are essential devices used for transferring heat between two interfaces. They work by heating a liquid until it becomes a vapor on the hot interface, after which the vapor travels to the cold interface and condenses back into a liquid. This process allows for efficient thermal transfer across a wide range of temperatures and applications.

These heat transfer devices come in various shapes such as flat, rectangular, round, and square, with each shape being suitable for different types of systems and spaces. The choice of shape depends on factors such as available space, power requirements, and desired cooling performance.

Moreover, thermal heat pipes and vapor chambers are identified by their unique properties such as power cooling, thermal resistance, and wick type. These characteristics determine the efficiency and effectiveness of the device in transferring heat in different environments and applications.

Power cooling refers to the rate at which the device can dissipate heat, while thermal resistance measures the ability of the device to resist heat flow. Wick type, on the other hand, refers to the material used to line the interior of the device, which affects the rate and efficiency of heat transfer.

In summary, thermal heat pipes and vapor chambers are crucial devices used in various industries for efficient thermal management. Their ability to transfer heat between two interfaces with high efficiency and reliability makes them essential for achieving optimal performance and longevity of electronic devices, power systems, and other applications that require efficient heat dissipation. The choice of device depends on factors such as available space, power requirements, and desired cooling performance, with their unique properties determining their efficiency and effectiveness in different applications.