Socket Adapters

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276
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
228-4817-19-0602J
RECEPTACLE DIP SOCKET 28POS .4"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.4" (10.16mm) Row Spacing
DIP, 0.4" (10.16mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
S 894-13-007-25-050000
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
248-1282-09-0602J
RECEPTACLE DIP SOCKET 48POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
48
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
242-1293-29-0602J
RECEPTACLE DIP SOCKET 42POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
242-1281-39-0602J
RECEPTACLE DIP SOCKET 42POS .6"
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
242-1281-29-0602J
RECEPTACLE DIP SOCKET 42POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
242-1281-19-0602J
RECEPTACLE DIP SOCKET 42POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
242-1281-09-0602J
RECEPTACLE DIP SOCKET 42POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
240-3639-09-0602J
RECEPTACLE DIP SOCKET 40POS 1.0"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 1.0" (25.40mm) Row Spacing
DIP, 1.0" (25.40mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
232-1285-39-0602J
RECEPTACLE DIP SOCKET 32POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
32
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
232-1285-09-0602J
RECEPTACLE DIP SOCKET 32POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
32
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
16-354W00-10
CONN ADAPTER 16PIN DIP TO SOWIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354W00
DIP, 0.3" (7.62mm) Row Spacing
SOWIC
16
0.100" (2.54mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
-
228-1290-29-0602J
RECEPTACLE DIP SOCKET 28POS .4"
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.4" (10.16mm) Row Spacing
DIP, 0.4" (10.16mm) Row Spacing
28
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
228-1277-29-0602J
RECEPTACLE DIP SOCKET 28POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-5248-19-0602J
RECEPTACLE DIP SOCKET 24POS .3"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-5248-09-0602J
RECEPTACLE DIP SOCKET 24POS .3"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
28-651000-11-RC
SOCKET ADAPTER SSOP TO 28DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 651000
SSOP
DIP, 0.6" (15.24mm) Row Spacing
28
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
16-304633-18
SOCKET ADAPTER 20PLCC TO 16DIP
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 304633
PLCC
DIP, 0.3" (7.62mm) Row Spacing
16
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
16-304235-10
16-PIN SOCKET TO PIN ADAPTER
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 304235
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
16
-
Gold
Through Hole
Solder
-
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
FR4 Epoxy Glass
24-354W00-10
CONN ADAPTER 24PIN DIP TO SOWIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354W00
DIP, 0.3" (7.62mm) Row Spacing
SOWIC
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
-

Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance.

Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs.

For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability.

Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design.

By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.