IC Sockets

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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialOperating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
382441-1
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
7 (1 x 7)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
382444-1
CONN SOCKET SIP 6POS TIN-LEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Press-Fit
0.100" (2.54mm)
Tin-Lead
6 (1 x 6)
Liquid Crystal Polymer (LCP)
-55°C ~ 105°C
-
SIP
150.0µin (3.81µm)
Phosphor Bronze
Closed Frame
150.0µin (3.81µm)
Phosphor Bronze
382444-2
CONN SOCKET SIP 8POS TIN-LEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
8 (1 x 8)
Fluoropolymer (FP)
-55°C ~ 105°C
-
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
150.0µin (3.81µm)
Beryllium Copper
382444-3
CONN SOCKET SIP 10POS TIN-LEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Press-Fit
0.100" (2.54mm)
Tin-Lead
10 (1 x 10)
Liquid Crystal Polymer (LCP)
-55°C ~ 105°C
-
SIP
150.0µin (3.81µm)
Phosphor Bronze
Closed Frame
150.0µin (3.81µm)
Phosphor Bronze
4-382568-8
CONN IC DIP SOCKET 48POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
48 (2 x 24)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
545092-4
CONN SOCKET PGA 48POS TIN-LEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
48 (4 x 12)
Polybutylene Terephthalate (PBT), Polyester
-40°C ~ 105°C
-
PGA
100.0µin (2.54µm)
Beryllium Copper
Open Frame
100.0µin (2.54µm)
Brass
641856-1
CONN IC DIP SOCKET 28POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Beryllium Copper
643641-6
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
9 (1 x 9)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
643644-3
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
12 (1 x 12)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
643646-1
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (1 x 14)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
643646-3
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (1 x 14)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
643646-6
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (1 x 14)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
643646-8
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (1 x 14)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
643647-1
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
15 (1 x 15)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
643650-1
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
18 (1 x 18)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
643652-1
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
643652-3
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
643652-6
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
643657-1
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
25 (1 x 25)
Thermoplastic, Glass Filled
-55°C ~ 105°C
Diplomate DL
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
523-13-289-17-000003
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Quantity
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PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
289 (17 x 17)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-
523
PGA
30.0µin (0.76µm)
-
-
10.0µin (0.25µm)
-

IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades.

Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance.

In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments.

Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations.

By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility.

In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.